Marker-Guided Electrode Coating for High-Speed Pattern Precision
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Solution Overview
Problem
Existing methods for manufacturing secondary battery electrodes suffer from precision issues in pattern formation due to substrate slipping and measurement inaccuracies, leading to reduced quality and increased defects.
Innovation Solution
A coating apparatus and method that utilizes a first material supply unit, a first sensor, and a processor to accurately position mixture layers on a substrate marked with repetitive markers, adjusting distances and thicknesses to ensure precise coating on opposite surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If substrate moving speed is increased to improve productivity, then coating precision deteriorates due to substrate slipping and measurement inaccuracies
Solution Approach 1:
The patent implements a feedback mechanism where sensors detect the position of markers on the substrate in real-time, and this position information is fed back to adjust the coating process. The system calculates the actual position of the substrate based on marker detection and dynamically adjusts coating parameters to compensate for substrate slipping, thereby maintaining coating precision even at high speeds
Solution Approach 2:
The patent replaces mechanical measurement methods with optical sensing technology. Instead of relying on mechanical encoders or physical position sensors that can accumulate errors, the system uses optical sensors to detect markers on the substrate, providing more accurate and slip-resistant position information for coating control
2Manufacturing precision
If coating precision is improved by reducing substrate speed, then productivity deteriorates
Solution Approach 1:
Real-time feedback from marker position detection allows the system to maintain high coating precision without reducing substrate speed. The feedback loop continuously monitors and adjusts coating parameters based on actual substrate position, enabling high-speed operation with precision comparable to low-speed mechanical systems
Solution Approach 2:
The patent introduces dynamic adjustment capabilities where coating parameters are not fixed but are continuously adapted based on real-time substrate position information. This dynamic control system allows the coating process to maintain precision while operating at optimal high speeds, rather than being constrained by static low-speed settings
3Measurement precision
If markers are added to the substrate for position detection, then device complexity increases but measurement precision improves
Solution Approach 1:
The patent changes the physical parameter of the substrate by adding markers, transforming it from a plain substrate to one with detectable reference features. This parameter change enables optical detection systems to accurately track substrate position and orientation, providing the measurement precision needed for high-speed coating control
Solution Approach 2:
The markers serve as an intermediary element between the substrate and the detection system. Rather than requiring complex direct measurement of substrate position, the markers provide easily detectable reference points that mediate the measurement process, simplifying the overall system while improving accuracy
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus and method reduce thickness deviations and improve electrode plate quality by controlling coating start points and maintaining uniform thickness, thereby enhancing yield and reducing defects.
Implementation Method 1
a first sensor configured to sense the first mixture layer and the markers
Data Source
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AI summary
Embodiments of the present disclosure provide a coating apparatus. The coating apparatus includes a first material supply unit configured to coat a first mixture layer on a first surface of a substrate, the substrate having markers repeatedly formed along a machine direction, a first sensor configured to sense the first mixture layer and the markers, and a processor configured to determine a position of the first mixture layer based on the markers.