Alignment Module with Integrated Cleaning Chamber
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Solution Overview
Problem
The challenge in semiconductor device manufacturing lies in the accurate alignment and cleaning of masks used during material deposition, as misalignment can render devices unusable and material buildup on masks reduces their functionality, while traditional cleaning methods are time-intensive and risk damaging the masks.
Innovation Solution
An integrated alignment module comprising a mask stocker, cleaning chamber, alignment stage, and transfer robot that houses, positions, and cleans masks with precision, allowing for accurate alignment and in-situ cleaning to extend mask lifespan and reduce downtime.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If masks are cleaned by traditional handling methods, then material buildup on masks is removed, but masks are at risk of being damaged during handling
Solution Approach 1:
The cleaning chamber is integrated into the alignment module, combining mask cleaning functionality with mask positioning and alignment capabilities. This integration allows masks to be cleaned in situ without removal from the system, eliminating handling risks while maintaining cleaning effectiveness
Solution Approach 2:
The system enables self-service cleaning where masks are cleaned within the alignment module itself through automated in-situ cleaning processes. This eliminates the need for external handling and manual cleaning operations that could damage the masks
2Reliability
If masks are removed for cleaning, then material buildup is removed, but processing downtime increases
Solution Approach 1:
The cleaning chamber is prepared and ready within the alignment module, allowing masks to be cleaned at any time during the process without requiring removal or external preparation. This preliminary setup enables immediate in-situ cleaning and eliminates downtime associated with mask removal and external cleaning operations
Solution Approach 2:
The integrated cleaning chamber enables continuous cleaning operations without interrupting the overall processing flow. Masks can be cleaned in situ while the system remains operational, maintaining continuous useful action and eliminating downtime that would occur with traditional removal-based cleaning methods
3Manufacturing precision
If multiple process steps (lithography, etching) are used for material deposition control, then deposition precision is achieved, but manufacturing complexity and cost increase
Solution Approach 1:
The mask-based deposition system provides multi-functionality by using a single masking approach to control both deposition patterns and enable subsequent cleaning without removal. This universal mask system replaces the need for separate lithography and etching process steps, reducing overall process complexity while maintaining precision
Solution Approach 2:
The system extracts and eliminates unnecessary process steps (lithography and etching) by using direct mask-controlled deposition. The mask serves multiple functions including pattern definition and cleaning containment, removing the need for intermediate processing steps and reducing manufacturing complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures accurate mask alignment during semiconductor processing, extends mask usability by cleaning them in situ, and reduces the risk of damage during handling, thereby improving manufacturing efficiency and reducing the need for costly lithography and etching steps.
Implementation Method 1
providing one or more cleaning gases into a chamber body of the cleaning chamber
Implementation Method 2
evacuating the cleaning gases from the chamber body
Data Source
AI summary
An alignment module for housing and cleaning masks. The alignment module comprises a mask stocker, a cleaning chamber, an alignment chamber, an alignment stage a transfer robot. The mask stocker is configured to house a mask cassette configured to store a plurality of masks. The cleaning chamber is configured to clean the plurality of masks by providing one or more cleaning gases into a chamber after a mask is inserted into the cleaning chamber. The alignment stage is configured to support a carrier and a substrate. The transfer robot is configured to transfer a mask from one or more of the alignment stage and the mask stocker to the cleaning chamber.