Vapor Deposition Mask Base Material for Precise Hole Etching

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Solution Overview

Problem

Vapor deposition masks face challenges in achieving dimensional accuracy due to vapor deposition material adhering to the wall surfaces of holes, which reduces the accuracy of patterns formed and complicates the manufacturing process, especially with thinner metal sheets that have varying elongation differences across their width.

Innovation Solution

A vapor deposition mask substrate with an undulated shape along its width direction, where the elongation difference ratios in the center section are less than or equal to 3×10−5 and in the edge sections are less than or equal to 15×10−5, is used to minimize material adherence and enhance pattern accuracy, achieved through specific rolling and etching processes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If the thickness of the vapor deposition mask is reduced to reduce the areas of the wall surfaces defining holes, then the amount of vapor deposition material adhering to the wall surfaces is reduced and the dimensional accuracy of the pattern is improved, but the permissible range of the duration for which the metal sheet is in contact with the etchant is shortened and the dimensional accuracy of the holes becomes difficult to achieve

Engineering Contradiction:
Improvedimensional accuracy of the patternVSAvoiddimensional accuracy of the holes
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The patent changes the physical parameter of mask thickness to reduce vapor deposition material adherence. By making the mask thinner, the wall surface area is reduced, which decreases the amount of material that adheres to the walls during vapor deposition, thereby improving pattern dimensional accuracy.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent introduces dynamic control of the etching process by adjusting the contact duration between the metal sheet and etchant based on the mask thickness. This allows optimization of the etching process to achieve required hole dimensional accuracy even with thinner masks, resolving the manufacturing difficulty.

Inventive Principle:
Principle #15Dynamics

2Object-generated harmful factors

If the thickness of the metal sheet is reduced to reduce the thickness of the vapor deposition mask, then the amount of vapor deposition material adhering to the wall surfaces is reduced, but the amount of metal to be etched is reduced and the permissible range of the duration for which the metal sheet is in contact with the etchant is shortened

Engineering Contradiction:
Improveamount of vapor deposition material adhering to wall surfacesVSAvoidpermissible range of etchant contact duration
Core Design Contradiction:
Object-generated harmful factorsVSEase of manufacture

Solution Approach 1:

The patent changes the parameter of mask thickness to reduce the harmful effect of vapor deposition material adherence. The thinner mask generates less adhesion problem. Simultaneously, the etching parameters are adjusted to compensate for the reduced metal thickness, maintaining manufacturability.

Inventive Principle:
Principle #35Parameter changes

3Ease of manufacture

If the metal sheet has an undulated shape with different elongation difference ratios at different positions, then the metal sheet can be manufactured through rolling or electrolysis, but different positions are brought into contact with the etchant for different durations and the dimensional accuracy of the holes becomes difficult to achieve

Engineering Contradiction:
Improvemanufacturability of metal sheetVSAvoiddimensional accuracy of the holes
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent applies local quality control by measuring and characterizing the elongation difference ratios at different positions (center section and edge sections) of the metal sheet. This local characterization allows for position-specific etching duration adjustments to achieve uniform hole dimensional accuracy across the entire sheet despite the undulated shape.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent implements a feedback mechanism where the elongation difference ratios are measured and used to determine the appropriate etching contact duration. This feedback loop allows optimization of the etching process to compensate for the undulated shape and achieve required dimensional accuracy.

Inventive Principle:
Principle #23Feedback

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach increases the accuracy of patterns formed by vapor deposition by reducing material adherence to the mask substrate's surface, improving the consistency of hole formation and pattern precision, and simplifies the manufacturing process by maintaining the required dimensional accuracy.

Implementation Method 1

The metal sheet has shapes that are taken along a longitudinal direction of the metal sheet at different positions in a width direction of the metal sheet and differ from one another, each of the shapes being an undulated shape including protrusions and depressions repeating in the longitudinal direction of the metal sheet

Methodology Applied
Scientific EffectRolling deformation: Deformation

Implementation Method 2

a technique is used to reduce the thickness of the metal sheet for manufacturing the vapor deposition mask. However, in the process of etching the metal sheet to form holes

Methodology Applied
Scientific EffectEtching:

Implementation Method 3

The vapor deposition material entering the holes through the second openings forms on the target a pattern corresponding to the position and shape of the first openings

Methodology Applied
Scientific EffectVapor deposition: Deposition (physical)

Data Source

PatentUS11390953B2Vapor deposition mask base material, vapor deposition mask base material manufacturing method, and vapor deposition mask manufacturing method
Publication Date: 2022.07.19 TOPPAN HOLDINGS INC
  • US11390953B2 patent drawing
  • US11390953B2 patent drawing
  • US11390953B2 patent drawing

AI summary

The ratio of the difference between a surface distance L at each of the different positions in a width direction DW of a metal sheet and a minimum surface distance Lm to the minimum surface distance Lm is an elongation difference ratio. The elongation difference ratio in a center section in the width direction DW of the metal sheet is less than or equal to 3×10−5. The elongation difference ratios in two edge sections in the width direction DW of the metal sheet are less than or equal to 15×10−5. The elongation difference ratio in at least one of the two edge sections in the width direction DW of the metal sheet is less than the elongation difference ratio in the center section in the width direction of the metal sheet.