Semiconductor Packaging Mask Coating Void Reduction
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Solution Overview
Problem
The semiconductor industry faces challenges in packaging semiconductor devices due to void formation issues caused by the limited fluidity of molding compound materials, which affects packaging efficiency and yield.
Innovation Solution
A novel mask coating is introduced, laminated on a temperate bond layer, which increases the fluidity of molding compound materials, thereby eliminating or reducing void formation and improving packaging processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional molding compound materials are used, then packaging process is straightforward, but void formation occurs due to limited fluidity
Solution Approach 1:
The patent applies parameter changes by modifying the fluidity characteristics of the molding compound material through controlled heating during the molding process. The material is heated to increase its fluidity, allowing it to flow more easily and fill voids, then cooled to return to its original state. This temporary parameter change enables the material to overcome its limited fluidity and eliminate void formation without permanently altering the material properties.
Solution Approach 2:
The patent implements periodic action through a cyclic heating and cooling process. The molding compound material undergoes periodic temperature changes: heated to increase fluidity during molding, then cooled to stabilize the package. This periodic thermal action allows the material to dynamically adjust its fluidity property, enabling void elimination while maintaining process control and packaging yield.
2Reliability
If molding compound material fluidity is increased to reduce voids, then packaging yield improves, but material control becomes more difficult
Solution Approach 1:
The patent resolves the material control difficulty by using temporary, controlled parameter changes. The molding compound's fluidity is increased only during the specific molding operation through controlled heating, then restored to normal by cooling. This time-limited parameter modification allows high fluidity when needed while maintaining ease of handling and control during other manufacturing stages.
Solution Approach 2:
The patent applies local quality by creating a spatial and temporal gradient in material properties. The molding compound is heated and becomes highly fluid only in the mold cavity during the molding operation, while the rest of the material handling process occurs at lower temperatures with normal viscosity. This localized property modification enables improved filling without compromising overall material control throughout the manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The use of the novel mask coating enhances the smooth application of molding compounds, reducing friction forces and voids, leading to increased packaging yields and improved packaging efficiency.
Implementation Method 1
reducing friction forces and voids
Data Source
AI summary
Packaged semiconductor devices and methods of packaging semiconductor devices are disclosed. In some embodiments, a method of packaging a semiconductor device includes forming a mask coating over a carrier, coupling an integrated circuit die over the mask coating, and disposing a molding compound around the integrated circuit die. The method includes forming an interconnect structure over the integrated circuit die and the molding compound.