Lithographic Mask Defect Repair Using Dual Particle Beam Parameters
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Solution Overview
Problem
Existing methods for repairing lithographic masks are inefficient in handling defects with extensive and/or small structures, as they often use uniform processing parameters, which can lead to suboptimal quality and speed in defect repair.
Innovation Solution
A method and apparatus that utilize two distinct sets of processing parameters for repairing defects, allowing for optimized processing of different regions of a defect based on their specific requirements, such as using high precision and low speed for fine structures and higher speed with lower precision for coarse structures, by adjusting intrinsic beam parameters and gas chemistry.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If uniform processing parameters are used for defect repair, then the process is simple to operate, but the manufacturing precision and productivity are suboptimal for defects with extensive and/or small structures
Solution Approach 1:
The patent applies local quality by dividing the defect into different regions (fine structures and coarse structures) and applying different processing parameters to each region. Fine structures are processed with high precision parameters (lower beam current, lower beam flux) while coarse structures are processed with higher speed parameters (higher beam current, higher beam flux), thereby optimizing repair quality for each specific structural type without requiring uniformly complex parameter sets.
Solution Approach 2:
The patent segments the defect processing into distinct categories based on structure characteristics. The defect is divided into fine structures requiring high precision and coarse structures allowing higher speed processing. This segmentation enables the system to apply appropriate processing parameters to each segment, improving overall manufacturing precision while managing device complexity through structured parameter categorization.
2Manufacturing precision
If high precision processing parameters are used for all defect regions, then the manufacturing precision is improved, but the processing time increases
Solution Approach 1:
The patent implements local quality by matching processing parameters to the specific requirements of each defect region. Fine structures are processed with high precision parameters (lower beam current, lower beam flux) to ensure quality, while coarse structures are processed with higher speed parameters (higher beam current, higher beam flux) to maximize productivity. This localized approach ensures high manufacturing precision where needed without sacrificing overall processing speed.
Solution Approach 2:
The patent applies partial action by using high precision processing only for the portions of the defect that require it (fine structures), rather than applying high precision parameters to the entire defect. Coarse structures receive expedited processing with higher beam current and flux, thereby achieving acceptable precision while significantly reducing total processing time and improving productivity.
3Productivity
If high beam current and beam flux are used for processing, then the processing speed is improved, but the manufacturing precision deteriorates for fine structures
Solution Approach 1:
The patent applies local quality by assigning different beam parameters to different defect regions based on their structural characteristics. Fine structures are processed with lower beam current and beam flux to maintain manufacturing precision and avoid damage, while coarse structures are processed with higher beam current and beam flux to maximize processing speed. This spatial differentiation of processing conditions resolves the contradiction between speed and precision.
Solution Approach 2:
The patent uses partial action by applying high beam current and beam flux only to coarse structures that can tolerate such conditions, rather than applying these high-speed parameters uniformly across all defect types. This selective application maintains high processing speed for suitable regions while preserving manufacturing precision for fine structures that require gentler processing conditions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables high-quality defect repair with minimal processing time by tailoring the repair process to the specific characteristics of each defect region, improving both resolution and throughput.
Implementation Method 1
The repair is typically effected with a particle beam (comprising, e.g., electrons, ions, atoms, molecules and/or photons) with specific intrinsic beam parameters. Together with a precursor gas to which the mask is exposed, the particle beam excites a local chemical reaction at the mask under defined process parameters.
Data Source
AI summary
Methods for repairing a defect of a lithographic mask with a particle beam are described. One such method can comprise the following steps: Processing the defect with the particle beam with a first set of processing parameters; processing the defect with the particle beam with a second set of processing parameters; wherein at least one parameter from the first set of processing parameters differs from the second set of processing parameters.