Mask Manufacturing via Dual Conductive Layers for OLED Peeling
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Solution Overview
Problem
The manufacturing of masks for organic light-emitting display devices using electroplating faces challenges in achieving high surface roughness for easy peeling and alignment, leading to difficulties in obtaining high-resolution patterns and uniform thickness.
Innovation Solution
A method involving the formation of a first conductive layer with a mesh shape and a second conductive layer with oxidized regions to create a plating layer with high surface roughness for easy peeling and alignment, using conductive layers with different resistances to ensure uniform thickness and reduce damage during the process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a mask is manufactured using wet-etching process, then the manufacturing process is simple, but it is difficult to precisely control the pattern width and obtain high-resolution patterns
Solution Approach 1:
The patent changes the etching parameter from isotropic wet-etching to anisotropic plasma etching, which enables precise control of pattern width and high-resolution patterning while maintaining process feasibility through optimized etching conditions
Solution Approach 2:
The patent replaces the chemical wet-etching process with a plasma-based physical-chemical etching process, achieving better pattern control through directional ion bombardment and reduced lateral etching
2Ease of operation
If a plating layer is formed with high surface roughness, then the mask can be easily peeled off from the substrate, but the alignment detection becomes difficult due to high reflectance
Solution Approach 1:
The patent applies different surface qualities to different regions: the main body of the plating layer has high surface roughness for easy peeling, while the align key region maintains low surface roughness for optimal optical detection and alignment
3Manufacturing precision
If a single conductive layer is used for electroplating, then the manufacturing process is simple, but the thickness uniformity and peeling ease are compromised
Solution Approach 1:
The patent divides the conductive layer into two distinct layers with different resistances: a first conductive layer with lower resistance for uniform current distribution and thickness control, and a second conductive layer with higher resistance for controlled peeling ease
Solution Approach 2:
The patent uses a composite structure of two conductive layers with different electrical properties, combining the benefits of uniform plating (from the low-resistance layer) and controlled peeling (from the high-resistance layer)
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution allows for easy peeling of the mask from the substrate, minimizes damage, and improves alignment accuracy by reducing reflectance, resulting in a mask with high surface roughness and uniform thickness for precise pattern formation.
Implementation Method 1
forming a plating layer on the first conductive layer and the second conductive layer
Implementation Method 2
oxidizing the exposed part of the first conductive layer through the at least one opening of the second conductive layer
Data Source
AI summary
Provided is a method of manufacturing a mask includes preparing a first conductive layer. The first conductive layer includes a third portion having a mesh shape in a plurality of cell regions on a substrate, a second portion disposed between the cell regions, and a first portion surrounding the third portion and the second portion. The method further includes preparing a second conductive layer including at least one opening on the first conductive layer. The method also includes oxidizing a part of the first conductive layer exposed through the at least one opening of the second conductive layer. The method further includes preparing a plating layer on the first conductive layer and the second conductive layer, and removing the first conductive layer and the second conductive layer from the plating layer.