Transparent Conductive Metallization via Mask Exposure
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Solution Overview
Problem
Existing methods for producing transparent electrodes and effect pigments result in random metal line routing and broad size distribution, respectively, due to uncontrolled crack formation and solvent usage, leading to irregular edges and reduced brightness.
Innovation Solution
A mask exposure method involving a radiation-crosslinkable, washable ink layer applied to a carrier substrate, irradiated in defined regions using a shadow mask, followed by solvent removal of non-irradiated ink, allowing for precise metallization and pigment production with controlled geometry and improved optical properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a crack-forming coating is applied and dried to form cracks statistically, then a transparent electrode can be produced, but the metal line routing becomes random and manufacturing precision deteriorates
Solution Approach 1:
A patterned resist layer is applied to the substrate before metallization, pre-defining the desired metal line routing pattern. This preliminary patterning step ensures that subsequent metallization follows the intended design rather than forming random cracks, resolving the contradiction between ease of manufacture and manufacturing precision.
Solution Approach 2:
A patterned resist layer serves as an intermediary between the substrate and the metallization layer. This intermediary component transfers the desired pattern to the metal deposition process, enabling precise metal line routing while maintaining ease of manufacture through a standardized photolithography process.
2Reliability
If effect pigments are produced by extensive vapor deposition on foil followed by removal and comminution, then multilayer construction is achieved, but solvent usage increases and brightness deteriorates due to uncontrolled detachment and fine fraction generation
Solution Approach 1:
A patterned resist layer is applied to the substrate before metallization, pre-defining the desired metal line routing pattern. This preliminary patterning step ensures that subsequent metallization follows the intended design rather than forming random cracks, resolving the contradiction between ease of manufacture and manufacturing precision.
Solution Approach 2:
A patterned resist layer serves as an intermediary between the substrate and the metallization layer. This intermediary component transfers the desired pattern to the metal deposition process, enabling precise metal line routing while maintaining ease of manufacture through a standardized photolithography process.
3Ease of manufacture
If multilayer construction is removed from foil by solvent and comminuted, then effect pigments are produced, but broad size distribution and irregular edges occur leading to reduced brightness
Solution Approach 1:
A patterned resist layer is applied to the substrate before metallization, pre-defining the desired metal line routing pattern. This preliminary patterning step ensures that subsequent metallization follows the intended design rather than forming random cracks, resolving the contradiction between ease of manufacture and manufacturing precision.
Solution Approach 2:
A patterned resist layer serves as an intermediary between the substrate and the metallization layer. This intermediary component transfers the desired pattern to the metal deposition process, enabling precise metal line routing while maintaining ease of manufacture through a standardized photolithography process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the creation of transparent, conductive metallizations with defined metal line structures and platelet-shaped pigments, offering enhanced transparency, electrical conductivity, and optical performance with controlled geometry and reduced solvent usage.
Implementation Method 1
the irradiation of the radiation-crosslinkable, washable ink layer in defined regions by means of a shadow mask, so that the washable ink is cured in the defined regions
Data Source
AI summary
The invention relates to a mask exposure method comprising the following steps: —the providing of a carrier substrate; the print application of a radiation-crosslinkable washable dye layer to the full area of the carrier substrate; —the exposure of the radiation-crosslinkable washable dye layer in defined regions to radiation by means of a radiation mask, such that the washable dye is cured in the defined regions; —the applying of a metallization over the full area; —the removing of the non-radiation-exposed washable dye outside the defined regions together with the metal present thereon with the aid of a solvent, such that the resultant carrier substrate has cured washable dye with metal applied thereto only in defined regions.