Sacrificial Mask Frame for Uniform Light Outcoupling
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Solution Overview
Problem
Current methods for producing optoelectronic semiconductor components face challenges in achieving uniform light outcoupling, often resulting in inefficient and complex processes that can damage or contaminate the semiconductor chips during singulation.
Innovation Solution
A method involving a carrier with a main carrier side and optoelectronic semiconductor chips, where the chips are applied with a mask frame and potted with a conversion material to form a conversion element that covers the main emission side, allowing for simple and efficient production with uniform light outcoupling, and the mask frame is destroyed to facilitate easy separation without sawing or laser-based methods.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional singulation methods (sawing or laser-based) are used to separate semiconductor chips, then individual components can be obtained, but the chips are damaged or contaminated during the process
Solution Approach 1:
The patent applies preliminary action by forming a sacrificial mask frame around each semiconductor chip before the singulation process. This mask frame is created in advance and serves as a protective structure that enables subsequent separation without direct contact with the chip edges, thereby preventing damage and contamination during singulation.
Solution Approach 2:
The patent introduces an intermediary element - the sacrificial mask frame - that mediates between the need for chip separation and the protection of chip integrity. This mask frame acts as a temporary structure that facilitates the singulation process while protecting the semiconductor chips from direct mechanical or thermal contact during separation.
2Manufacturing precision
If complex production processes are used to achieve uniform light outcoupling, then optical uniformity is improved, but production efficiency decreases
Solution Approach 1:
The sacrificial mask frame is formed in advance around each semiconductor chip, establishing precise boundaries before the conversion material is applied. This preliminary structuring ensures uniform light outcoupling by defining exact regions for material deposition, while the entire process can be performed in a single production run, maintaining high efficiency.
Solution Approach 2:
The patent applies segmentation by creating individual mask frames around each semiconductor chip or group of chips. This segmentation allows for precise control of conversion material application in specific regions, ensuring uniform light outcoupling across each chip while enabling parallel processing of multiple chips, thus maintaining productivity.
3Reliability
If sensitive luminescent materials are used in the conversion element, then optical performance is improved, but the materials are damaged by conventional singulation methods
Solution Approach 1:
The sacrificial mask frame serves as an intermediary protective structure that shields the sensitive luminescent materials during the singulation process. By providing a physical barrier and defining separation boundaries, the mask frame prevents direct contact between the fragile luminescent materials and the mechanical or thermal fields used in conventional singulation methods.
Solution Approach 2:
The mask frame is formed in advance before the singulation process, creating a protective structure around the luminescent materials. This preliminary action ensures that the sensitive materials are already protected when separation is performed, preventing damage while allowing individual components to be obtained.
4Ease of manufacture
If fixed conversion element shapes are used, then manufacturing is simplified, but design flexibility is reduced
Solution Approach 1:
The sacrificial mask frame enables local quality by allowing different shapes and configurations of conversion elements to be defined around each semiconductor chip or group of chips. Each mask frame can be tailored to specific design requirements, enabling diverse conversion element geometries while maintaining a consistent and simple overall manufacturing process.
Solution Approach 2:
By forming the sacrificial mask frame in advance with the desired shape, the patent enables design flexibility without complicating the manufacturing process. The preliminary structuring of the mask frame defines the exact geometry needed, and subsequent material application follows this pre-established template, maintaining simplicity while achieving custom shapes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the simple and efficient production of optoelectronic semiconductor components with uniform light outcoupling, reducing the risk of damage and contamination during singulation, and allowing for the use of sensitive luminescent materials, while enabling the design of freely shaped conversion elements.
Implementation Method 1
a conversion material, such that a layer of the conversion material is in each case deposited on the semiconductor chips, which layer is then formed into a conversion element
Data Source
AI summary
A method for producing optoelectronic semiconductor components (100) is specified, wherein a carrier (1) having a carrier main side (11) is provided. Furthermore, a plurality of singulated optoelectronic semiconductor chips (2) are provided, wherein the semiconductor chips (2) each have a main emission side (21) and a contact side (22) opposite the main emission side (21). The singulated semiconductor chips (2) are then applied to the carrier main side (11), such that the contact side (22) in each case faces the carrier main side (11). In regions between the semiconductor chips, a mask frame (3) is applied, wherein the mask frame (3) is a grid of partitions (31). In a plan view of the carrier main side (11), each semiconductor chip (2) is surrounded all around by the partitions (31). The semiconductor chips (2) are potted with a conversion material (4) such that a conversion element (41) is respectively formed on the semiconductor chips (2). In this case, the conversion element (41) at least partly covers the main emission side (21) of the respective semiconductor chip (2). The carrier (1) is then removed. In a further step, the optoelectronic semiconductor components (100) are detached from the mask frame (3), the mask frame (3) being destroyed.