Mask Inspection System Defect Data Extraction
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Solution Overview
Problem
Conventional mask inspection systems struggle to accurately identify and repair subtle pattern defects, such as pattern edge irregularities, line width errors, and displacement, due to insufficient repair information, which affects the yield and throughput of semiconductor manufacturing.
Innovation Solution
An inspection system that captures optical images, generates reference images from design data, compares them to detect defects, and extracts specific data for precise defect location, allowing for improved identification and repair of pattern portions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional mask inspection systems use basic defect detection methods, then the inspection process is simple, but the ability to identify subtle pattern defects is insufficient
Solution Approach 1:
The patent segments the defect analysis process into multiple stages: initial defect detection, candidate defect selection based on specific criteria (isolated defects, extrusion defects, intrusion defects), and detailed verification. This segmentation allows the system to focus computational resources on potentially problematic areas while maintaining overall system simplicity.
Solution Approach 2:
The patent applies different inspection strategies to different types of defects. Instead of treating all defects uniformly, the system identifies specific defect types (isolated defects with no surrounding pattern, extrusion defects protruding from pattern, intrusion defects inside pattern) and applies targeted analysis methods to each, improving detection accuracy without uniformly increasing complexity.
2Reliability
If the inspection system inspects the entire mask pattern, then all defects can be detected, but the inspection time increases
Solution Approach 1:
The patent extracts and focuses inspection efforts on specific candidate defect types that are most likely to cause manufacturing issues. By isolating and prioritizing the inspection of isolated defects, extrusion defects, and intrusion defects, the system achieves reliable defect detection while reducing the overall inspection time and increasing throughput.
Solution Approach 2:
The patent applies partial inspection action by focusing detailed analysis only on identified candidate defects rather than performing exhaustive inspection on every point of the mask pattern. This selective approach maintains detection reliability for critical defect types while significantly improving inspection productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances the ability to identify and repair subtle pattern defects, thereby improving the yield and throughput of the manufacturing process by providing detailed information for precise repair actions.
Implementation Method 1
Light transmitted through or reflected from the mask pass through the lens
Implementation Method 2
Light transmitted through or reflected from the mask pass through the lens and are received by image sensors via a lens
Data Source
AI summary
An inspection system determines, for each detected pattern defect, a defect inspection pattern area of predetermined dimensions containing the coordinates of the defect, then determines the clusters or cells whose reference points are located within the defect inspection pattern area. The system extracts the data of these clusters or cells from design pattern data read from a first magnetic disk unit. The system then generates an output file containing the extracted data. The output file is then converted into the same format as the input design pattern data or into OASIS format, before it is output to a second magnetic disk unit. The extracted pattern data specifying the clusters or cells within each defect inspection pattern area can be output from the mask inspection system to external systems.