Mask-Integrated Surface Protective Tape for Plasma Dicing
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Solution Overview
Problem
The plasma dicing method for semiconductor chip production requires a high reactivity gas like SF6, necessitating a preliminary mask formation process via photolithography, which increases costs, leads to defective chips due to incomplete mask removal, and prolongs the processing time, and requires precise control of peeling strength between layers for selective exposure.
Innovation Solution
A mask-integrated surface protective tape with a release liner comprising a base film, temporary-adhesive layer, release film, and mask material layer, where the release film and liner have treated surfaces with controlled peeling strengths, allowing for mask exposure without photolithography, enabling selective peeling and maintaining surface condition during plasma dicing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If photolithography is used to form a mask for plasma dicing, then the mask formation is achieved, but the processing time increases and costs increase
Solution Approach 1:
The mask pattern is pre-formed on the release liner before the actual dicing process. The release liner with pre-patterned mask material is prepared in advance, so that when it is applied to the semiconductor wafer, the mask is already in position, eliminating the need for time-consuming photolithography steps during the dicing process
Solution Approach 2:
The release liner serves as an intermediary carrier that holds the mask material pattern. Instead of directly forming the mask on the wafer through photolithography, the mask pattern is first created on the release liner, which then transfers the mask to the wafer surface, simplifying the overall process
2Manufacturing precision
If photolithography is used to form a mask for plasma dicing, then the mask is formed, but the production cost increases
Solution Approach 1:
The mask formation process is merged with the release liner preparation process. The mask material is applied to the release liner along with the release coating, combining two functions into one integrated component. This eliminates the need for separate photolithography equipment and processes, reducing capital investment and operational costs
Solution Approach 2:
The release liner with integrated mask is designed as a disposable component. Instead of investing in expensive photolithography equipment and maintaining complex processes, the solution uses inexpensive pre-patterned release liners that are discarded after single use, significantly reducing production costs
3Manufacturing precision
If a mask is formed by photolithography for plasma dicing, then the mask protects the patterned face, but the mask removal becomes problematic causing defective chips
Solution Approach 1:
The adhesion parameters between different layers are carefully controlled. The mask material has strong adhesion to the release liner during processing, ensuring the mask stays in place. After dicing, the mask can be easily removed by changing the adhesion parameter through thermal or chemical treatment, allowing complete removal without leaving residues that would cause defects
4Manufacturing precision
If photolithography is used for mask formation, then the mask is created, but the overall processing process takes longer
Solution Approach 1:
The mask pattern is pre-formed on the release liner before the dicing process begins. This preliminary action allows the mask to be ready in advance, eliminating the need for time-consuming photolithography steps during the actual dicing operation, thereby increasing processing throughput
Solution Approach 2:
The release liner with pre-formed mask allows for continuous processing. Multiple wafers can be processed in sequence using the same pre-patterned release liner, maintaining continuous useful action without interruption for mask formation, thus improving overall productivity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution eliminates the need for photolithography, reduces chip production costs, minimizes defective chips, and efficiently controls peeling strengths to expose the mask material layer while maintaining its surface condition, thereby simplifying the processing steps and reducing environmental impact.
Implementation Method 1
the peeling strength between the release liner and the mask material layer is smaller than the peeling strength between the release film and the mask material layer
Implementation Method 2
In the backgrinding step of the semiconductor wafer, it is important to protect a patterned face of the semiconductor wafer
Implementation Method 3
The plasma dicing method is a method of dividing a semiconductor wafer, by selectively etching a portion not covered with a mask, using plasma
Implementation Method 4
a temporary-adhesive layer, wherein the release film and the release liner each have one release-treated surface
Data Source
AI summary
A mask-integrated surface protective tape with a release liner, containing: a base film, a temporary-adhesive layer, a release film, a mask material layer, and a release liner, in this order,wherein the release film and the release liner each have one release-treated surface, and the release-treated surfaces of the release film and the release liner each are in contact with the mask material layer, andwherein the peeling strength between the release liner and the mask material layer is smaller than the peeling strength between the release film and the mask material layer.