Mask Manufacturing Using Laser Ablation
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Solution Overview
Problem
The existing methods for manufacturing masks, particularly for large-area applications, are inefficient due to the need for multistage photolithography processes, which reduce process efficiency and are not suitable for producing large-area masks.
Innovation Solution
A method involving a base substrate with light-absorbing layer patterns and a reflective layer, where the reflective patterns are formed by partially removing the reflective layer using laser irradiation, eliminating the need for photolithography processes and allowing for easier manufacturing of large-area masks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If multistage photolithography processes are used to manufacture masks, then manufacturing precision can be achieved, but device complexity and loss of time increase significantly
Solution Approach 1:
The patent extracts and eliminates the photolithography process steps from the mask manufacturing workflow. By using direct laser writing to pattern the mask layer, the complex multistage photolithography process (including photoresist coating, exposure, development, and etching) is removed entirely, retaining only the essential patterning function while drastically simplifying the overall manufacturing process
Solution Approach 2:
The patent replaces the mechanical/chemical photolithography system with an optical direct-writing system. Instead of using photoresist chemicals and multiple processing stages, the invention uses laser beams to directly ablate or modify the mask material, substituting a complex mechanical-chemical process with a more efficient optical process that achieves the same patterning result in fewer steps
2Manufacturing precision
If multistage photolithography processes are used to manufacture masks, then manufacturing precision can be achieved, but productivity decreases due to multiple processing steps
Solution Approach 1:
The patent merges multiple separate photolithography process steps into a single integrated laser writing operation. Functions that were previously distributed across coating, exposure, development, and etching stages are combined into one direct laser patterning step, reducing the total number of process stages and improving manufacturing throughput while maintaining pattern precision
Solution Approach 2:
The patent performs preliminary preparation of the mask layer (such as applying a suitable material coating) in advance, so that the subsequent laser writing process can directly create the final pattern without requiring intermediate photolithography steps. This preliminary preparation enables the laser to directly pattern the mask material, eliminating the need for photoresist and multiple processing stages
3Reliability
If conventional mask manufacturing methods are used, then transmissive and non-transmissive regions can be formed, but material loss increases due to photoresist coating and etching processes
Solution Approach 1:
The patent converts the potentially harmful laser energy (which could cause unwanted material modification) into a beneficial direct patterning tool. By carefully controlling laser parameters and selecting appropriate mask materials, the laser energy is used to precisely remove or modify only the intended regions, creating the pattern directly without the material loss associated with photoresist waste and etching byproducts
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the mask manufacturing process, improves efficiency, and enables the production of large-area masks by reducing material loss and omitting additional processing steps, such as photoresist coating and etching.
Implementation Method 1
The providing the reflective patterns includes removing the light-absorbing layer patterns and a portion of the reflective layer, by irradiating the light-absorbing layer patterns with laser light
Implementation Method 2
providing a base substrate including light-absorbing layer patterns on a first surface thereof
Data Source
AI summary
A method of manufacturing a mask includes: providing a base substrate including light-absorbing layer patterns on a first surface thereof; providing a reflective layer on the light-absorbing layer patterns and the first surface of the base substrate; and providing reflective patterns by partially removing the reflective layer. The providing the reflective patterns includes removing the light-absorbing layer patterns and a portion of the reflective layer, by irradiating the light-absorbing layer patterns with laser light.


