Mask Structure with Microlenses for Single-Step Circuit Substrate Patterning
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Solution Overview
Problem
Current circuit substrate manufacturing processes require multiple mask exposure steps, leading to alignment accuracy issues and increased process time, which hinders productivity.
Innovation Solution
A method that uses a single exposure process with a positive photoresist layer and a mask structure featuring microlens structures to simultaneously form concaves of different depths, reducing the frequency of exposure and improving alignment accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If multiple mask exposure processes are performed to form blind holes and intaglio patterns, then the conductive structures can be formed with different depths, but the process time increases and productivity decreases
Solution Approach 1:
The patent combines multiple exposure processes into a single exposure process by integrating blind hole patterns and intaglio patterns into one mask structure. This allows both types of concaves to be formed simultaneously in one exposure step, reducing the total number of exposure processes from two or more to one, thereby increasing productivity while maintaining the ability to form different depths through the mask's optical design
Solution Approach 2:
The mask structure is segmented into different regions with varying light transmittance properties - transparent regions for blind holes and microlens regions for intaglio patterns. This segmentation allows different areas of the photoresist layer to receive different amounts of light energy, enabling the formation of concaves with different depths in a single exposure process
2Manufacturing precision
If multiple mask exposure processes are performed to define blind holes and intaglio patterns, then the conductive structures can be formed, but alignment accuracy issues occur
Solution Approach 1:
By merging the definition of blind holes and intaglio patterns into a single mask exposure process, the patent eliminates the alignment errors that would otherwise occur between multiple sequential exposure steps. The single mask structure ensures that all concave patterns are defined in one alignment operation, removing the cumulative alignment errors inherent in multiple processes
Solution Approach 2:
The single mask structure acts as an intermediary that simultaneously defines both blind hole and intaglio patterns. This unified mask serves as a single reference for alignment, eliminating the need for multiple alignment operations and the associated accuracy issues that arise when transferring patterns between multiple masks
3Manufacturing precision
If two times of mask exposure processes are required, then blind holes and intaglio patterns can be formed with different depths, but the process time cannot be shortened
Solution Approach 1:
The patent merges the formation of different depth concaves into a single exposure process by using a mask structure with regions of different light transmittance. The transparent regions allow full light transmission for blind holes, while microlens regions focus light to create intaglio patterns at different depths. This simultaneous formation eliminates the time required for sequential exposure processes while maintaining depth differentiation
Solution Approach 2:
The patent changes the optical parameters of the mask structure by incorporating microlens structures with specific focal lengths and light transmittance properties. By varying these optical parameters across different regions of the mask, the system can control the depth of concave formation in different areas during a single exposure process, achieving depth differentiation without multiple exposure steps
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the reduction of process time and increased productivity by forming conductive blind holes and circuit patterns in a single exposure step, enhancing alignment accuracy and efficiency.
Implementation Method 1
Once exposure process is performed on the positive photoresist layer disposed on the substrate so as to simultaneously form concaves with at least two different depths
Implementation Method 2
a mask structure featuring microlens structures to simultaneously form concaves of different depths
Implementation Method 3
the conductive blind holes and the circuit structures are formed in the blind holes and the intaglio patterns respectively by an electroplating method
Data Source
AI summary
A mask structure and a manufacturing method of the mask structure are provided. The mask structure includes a transparent substrate, a patterned metal layer, and a plurality of microlens structures. The patterned metal layer is disposed on the transparent substrate and exposing a portion of the transparent substrate. The microlens structures are disposed on the transparent substrate exposed by a portion of the patterned metal layer and being in contact with the portion of the patterned metal layer.