Mask Plate Structure for Flexible OLED Passivation
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Solution Overview
Problem
Flexible OLED devices face fractures due to stress from inorganic passivation layers, leading to reduced bending performance and degradation from water and oxygen exposure.
Innovation Solution
A mask plate with a hollow, non-hollow, and semi-hollow region structure is used to form thinned passivation layers, reducing stress and preventing fractures during bending, comprising a manufacturing method that includes laser cutting or etching to create through holes and smooth edges, and a packaging method that staggers thinned regions for enhanced flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the inorganic passivation layer is made thicker to improve protection, then the protective function is improved, but the stress increases and fracture occurs during bending
Solution Approach 1:
The mask plate creates local quality variation in the passivation layer by forming thinned regions through semi-hollow patterns. The passivation layer has different thicknesses in different areas: thicker in non-hollow regions for protection, and thinner in semi-hollow regions to reduce stress during bending. This local thickness variation resolves the contradiction between protective function and bending strength.
Solution Approach 2:
The mask plate is segmented into hollow regions, non-hollow regions, and semi-hollow regions. The semi-hollow regions are further segmented into through holes arranged in specific patterns. This segmentation allows different areas of the passivation layer to have different thicknesses, enabling both protection and flexibility.
2Strength
If the inorganic passivation layer is made thinner to improve flexibility, then the bending performance is improved, but the protective function against water and oxygen deteriorates
Solution Approach 1:
The passivation layer is designed with local quality variation where thinned regions provide flexibility and non-hollow regions provide protection. The semi-hollow regions create controlled thin areas that reduce stress during bending while maintaining overall protective coverage through the distributed pattern of thinned and non-thinned areas.
Solution Approach 2:
The packaging structure uses a composite approach combining inorganic passivation layer with organic buffer layer. The composite structure leverages the protective properties of inorganic materials and the flexibility of organic materials, achieving both protection and bending performance.
3Ease of manufacture
If the passivation layer is made uniform in thickness to simplify manufacturing, then the manufacturing process is simplified, but the stress distribution becomes uneven and fractures occur
Solution Approach 1:
The mask plate implements local quality variation through semi-hollow regions with through holes, creating thinned areas in the passivation layer. This controlled non-uniformity improves stress distribution during bending while maintaining manufacturing simplicity through a systematic patterning approach that can be achieved through standard photolithography and etching processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the bending resistance of flexible OLED devices by minimizing stress-induced fractures and maintaining performance against water and oxygen exposure.
Implementation Method 1
The mask plate comprises a hollow region, a non-hollow region arranged around the hollow region, and a semi-hollow region in a strip form arranged in the hollow region... a thinned region is formed the region on the first passivation layer corresponding to the semi-hollow region
Implementation Method 2
the through holes are formed by laser cutting, photolithography, or etching process
Implementation Method 3
using etching or laser cutting manner to process hollowing treatment on the hollow region
Data Source
AI summary
The disclosure is related to a mask plate and its manufacturing method, and OLED device packaging method. The mask plate comprises a hollow region; a non-hollow region arranged around the hollow region; and a semi-hollow region in a strip form arranged in the hollow region, having a head portion and a tail portion respectively connecting with the non-hollow region. By way of the above manner, the disclosure may enhance the bending performance of the flexible OLED device package.


