Mask Assembly with Recesses for Multi-Layer Solder Paste Printing
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Solution Overview
Problem
Current methods for applying multiple types of solder pastes to a circuit board damage existing solder bodies, limiting the ability to use conventional printing techniques for forming multiple solder pastes, resulting in inefficiencies and increased labor costs.
Innovation Solution
A mask assembly with a first mask plate and a second mask plate, where the second mask plate includes a recess to protect the first solder body and a through-hole for the second solder paste, allowing for the simultaneous formation of two different solder bodies on a substrate using conventional printing methods.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a second mask plate is used to apply a second solder paste to regions with existing first solder bodies, then the second solder paste can be applied to the substrate, but the existing first solder bodies are damaged by the second mask plate
Solution Approach 1:
The second mask plate is segmented into two distinct functional regions: through-holes for applying second solder paste to new regions, and recesses for protecting existing first solder bodies. This segmentation allows the mask plate to simultaneously perform protection and application functions without damaging existing solder structures.
Solution Approach 2:
The recesses in the second mask plate act as intermediary protective structures between the mask plate and existing first solder bodies. These recesses provide physical clearance that prevents the mask plate from contacting and damaging the first solder bodies while still allowing the second solder paste to be applied to adjacent regions.
2Reliability
If manual formation of solder bodies is used to apply a second solder paste, then the existing first solder bodies are not damaged, but time and manpower are wasted
Solution Approach 1:
The second mask plate merges two previously separate operations into one: the protection of first solder bodies and the application of second solder paste. By integrating protective recesses with paste-application through-holes in a single mask plate, the invention enables automated simultaneous execution of both tasks, eliminating the need for manual intervention.
Solution Approach 2:
The second mask plate is designed as a multi-functional tool that simultaneously serves as a protective cover for existing solder bodies and as an application tool for new solder paste. This universality allows a single device to perform multiple functions that previously required separate manual operations, significantly improving productivity.
3Ease of manufacture
If a conventional printing apparatus is used to apply multiple types of solder pastes, then the existing printing equipment can be utilized, but the existing solder bodies are damaged
Solution Approach 1:
The second mask plate is designed with spatially varying local qualities: regions with through-holes for paste application and regions with recesses for protection. This local differentiation allows the mask plate to interact differently with various regions of the substrate, enabling conventional printing apparatus to safely apply multiple solder pastes without damaging existing structures.
Data Source
AI summary
A method for forming solder bodies on a substrate includes: positioning a first mask plate, which is formed with at least one first through-hole, on the substrate; filling the first through-hole with a first solder paste so as to form a first solder body on the substrate; positioning a second mask plate, which is formed with at least one second through-hole and at least one recess spaced apart from the second through-hole, on the substrate in such a manner that the first solder body is received in the recess; and filling the second through-hole with a second solder paste so as to form a second solder body on the substrate.