Mask Manufacturing via Segmented Exposure and Merging
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Solution Overview
Problem
The high cost and resource-intensive process of manufacturing larger exposure masks for organic device substrates, such as those for eighth-generation substrates, due to the need for extensive facilities and heavy investment.
Innovation Solution
A method of manufacturing a mask with a first and second portion, each exposed using separate exposure masks, allowing for the formation of through-hole groups in a laminated body with a base material and resist layer, enabling the production of larger masks using existing facilities by executing exposure steps in multiple sections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the size of the exposure mask is increased to manufacture larger substrates, then the substrate size increases, but the investment for manufacturing facilities increases heavily
Solution Approach 1:
The mask is divided into a first portion and a second portion, each corresponding to a separate exposure mask. The first exposure mask forms through-hole groups in the first portion, while the second exposure mask forms through-hole groups in the second portion. This segmentation allows existing smaller exposure masks to be used without requiring investment in larger exposure mask facilities.
2Device complexity
If a single large exposure mask is used, then the manufacturing process is simplified, but the facility investment and infrastructure requirements increase
Solution Approach 1:
The exposure process is segmented into first and second exposure processes using separate exposure masks. The first exposure mask exposes the resist layer for the first portion, and the second exposure mask exposes the resist layer for the second portion. This approach uses existing smaller facilities rather than requiring new large-scale facilities.
Solution Approach 2:
The first portion and second portion are combined to form the complete mask with all required through-hole groups. The resist layer is developed after both exposure processes, and the base material is etched through the developed resist pattern, merging the results of both exposure processes into a single functional mask.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the investment required for increasing mask size, allowing for the production of larger masks without the need for extensive facility upgrades, thereby lowering manufacturing costs and increasing productivity.
Implementation Method 1
a first exposure process of exposing the resist layer corresponding to the first portion by using a first exposure mask; a second exposure process of exposing the resist layer corresponding to the second portion by using a second exposure mask
Implementation Method 2
a process of etching the original base material through the resist layer corresponding to the first portion and the resist layer corresponding to the second portion
Data Source
AI summary
A mask may include a first portion including at least one first through-hole group, and a second portion including at least one second through-hole group located next to the first through-hole group in a first direction. A method of manufacturing the mask may include: a step of preparing a laminated body that includes an original base material and a resist layer; a first exposure process of exposing the resist layer corresponding to the first portion by using a first exposure mask; a second exposure process of exposing the resist layer corresponding to the second portion by using a second exposure mask; a process of developing the resist layer corresponding to the first portion and the resist layer corresponding to the second portion; and a process of etching the original base material through the resist layer corresponding to the first portion and the resist layer corresponding to the second portion.