Mask-Support Assembly Structure for Stable OLED Pixel Deposition
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Solution Overview
Problem
Conventional OLED manufacturing processes face challenges in aligning and stabilizing large-area masks during pixel deposition, leading to potential sagging or twisting due to load, which can result in ultra-high-resolution pixel failure, especially in microdisplay applications for virtual reality devices that require precise and uniform mask alignment.
Innovation Solution
A mask-support assembly is developed using a silicon wafer as a substrate, with a mask made of Invar or Super Invar material, featuring a circular shape and a connection portion to ensure uniform stress distribution and alignment, and a producing method that includes electroforming, heat treatment, and etching to form a stable mask-frame assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a thin mask film with large area is used for pixel deposition, then the mask can cover the entire substrate area, but the mask sags or twists under load and cannot be well aligned
Solution Approach 1:
The mask structure is divided into multiple segments: a rigid frame structure and a mask film portion. The frame provides structural support and dimensional stability, while the mask film portion carries the actual pattern. This segmentation allows the large-area mask to maintain both coverage and alignment precision by distributing mechanical loads to the rigid frame rather than relying solely on the thin mask film.
Solution Approach 2:
The mask assembly uses composite construction combining a rigid frame material (providing structural strength) with a mask film material (providing pattern definition). This composite structure enables the mask to simultaneously achieve large area coverage, mechanical stability against sagging/twisting, and precise alignment for ultra-high-resolution pixel formation.
2Area of stationary object
If a thin mask film with large area is used for pixel deposition, then the mask can cover the entire substrate area, but the mask cannot be well aligned due to sagging or twisting
Solution Approach 1:
The mask is segmented into a stable rigid frame and a flexible mask film portion. The frame maintains structural integrity and resists deformation under load, while the film portion adapts to the deposition process. This segmentation resolves the contradiction by assigning stability requirements to the frame and area coverage requirements to the film.
Solution Approach 2:
The rigid frame acts as an intermediary between the substrate and the thin mask film. It provides mechanical support and stress distribution, preventing the thin film from sagging or twisting while allowing the film to maintain its large area coverage for complete substrate illumination.
3Reliability
If conventional welding and fixing methods are used to attach the mask to the frame, then the mask can be secured, but the mask deforms due to load during the process
Solution Approach 1:
The mask film is pre-stretched or pre-positioned on the rigid frame before the actual welding or fixing process. This preliminary action ensures that the mask is properly aligned and tensioned beforehand, preventing deformation during subsequent fixation steps. The rigid frame maintains this pre-established alignment throughout the manufacturing process.
Solution Approach 2:
The fixing process utilizes controlled parameter changes (such as temperature, stress, or chemical bonding conditions) to attach the mask to the frame without causing deformation. By carefully managing these parameters, the mask achieves reliable fixation while maintaining its geometric integrity and alignment precision for ultra-high-resolution applications.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables clear alignment and stability of the mask during pixel deposition, preventing sagging and ensuring uniform stress distribution, thereby achieving ultra-high-resolution pixels with improved pixel deposition stability and alignment.
Implementation Method 1
the mask metal film made of an Invar or Super Invar material may be formed on the substrate by an electroforming method
Implementation Method 2
performing heat treatment on the mask metal film and the support
Data Source
AI summary
The present invention relates to a producing method of a mask-support assembly. The producing method of a mask-support assembly for use in a process of forming OLED pixels on a semiconductor wafer may include the steps of: (a) preparing a support; (b) forming a mask metal film on a first surface of the support; and (c) forming a mask including a mask pattern by etching the mask metal film.