Masked Pulsed Laser Spot Alignment for Accurate Micro LED Transfer
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Solution Overview
Problem
Current laser transfer technologies for micro LEDs face issues with spatial accuracy and energy efficiency, particularly due to synchronization problems with high repetition rate lasers, leading to inefficiencies in energy usage and spatial accuracy.
Innovation Solution
A laser processing equipment and method utilizing a pulsed laser light source, vibration mirror, mask with openings, and focusing module to precisely focus laser spots on processing elements, combined with a pulse on demand mode to optimize energy usage and improve spatial accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If high repetition rate laser is used, then processing speed is improved, but spatial accuracy deteriorates due to temporal jitter from synchronization issues
Solution Approach 1:
The patent employs periodic pulsed laser action with precise timing control, where laser pulses are delivered in synchronized periods matching the scanner's operational cycle. This periodic action eliminates temporal jitter by ensuring each pulse occurs at the correct phase of the scanning cycle, thereby maintaining spatial accuracy while achieving high processing speeds through optimized pulse frequency.
2Productivity
If high energy laser is used, then processing efficiency is improved, but energy usage efficiency deteriorates
Solution Approach 1:
The patent dynamically adjusts laser pulse parameters including energy per pulse, pulse duration, and pulse frequency based on real-time processing requirements. By optimizing these parameters, the system achieves high processing efficiency with minimal energy waste, delivering sufficient energy only when and where needed rather than using continuously high energy levels.
Solution Approach 2:
The pulsed laser delivers energy in periodic bursts rather than continuous operation, with idle periods between pulses allowing energy recovery and reducing overall energy consumption. This periodic action maintains high processing efficiency during active pulses while significantly improving energy usage efficiency across the complete operational cycle.
3Manufacturing precision
If current laser transfer technology is used for micro LEDs less than 50 microns, then processing capability is achieved, but both space and time energy usage efficiency deteriorate
Solution Approach 1:
The patent concentrates laser energy precisely at the local position of each micro LED requiring processing, using focused pulsed beams delivered to specific coordinates. This localized energy delivery ensures that energy is wasted only in the immediate processing zone rather than being dispersed, thereby achieving high processing capability for sub-50-micron devices while minimizing overall energy loss.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances spatial accuracy and energy efficiency, enabling high production capacity and reducing energy waste, thereby improving the overall processing efficiency.
Implementation Method 1
a pulsed laser light source to provide a pulsed laser beam
Implementation Method 2
a vibration mirror to turn the pulsed laser beam
Implementation Method 3
a focusing module to respectively focus the pulsed laser beam passing through the openings into multiple laser spots
Data Source
AI summary
A laser processing equipment includes a laser unit and a carrier. The laser unit includes a pulsed laser light source, a vibration mirror, a mask, and a focusing module. The pulsed laser light source provides a pulsed laser beam. The vibration mirror turns the pulsed laser beam. The mask receives the pulsed laser beam. The mask has multiple openings distributed along a first direction. The openings are used to allow the pulsed laser beam to pass through. The focusing module respectively focuses the pulsed laser beam passing through the openings into multiple laser spots distributed along the first direction. The carrier carries multiple processing elements. The processing elements are disposed corresponding to distribution positions of the laser spots along the first direction. A laser processing method is also provided.