Masked Light Distribution for Batch Soldering Mixed-Color LED Chips

The patent divides the soldering process into multiple parallel channels by using a mask with multiple light-transmissive portions. Each portion corresponds to a specific chip position, allowing simultaneous soldering of multiple chips through segmented light paths from a single laser source, thereby improving productivity without requiring proportionally more complex equipment

The patent combines multiple soldering operations into a single batch process by integrating a mask that guides light to multiple chip positions simultaneously. This merging of parallel soldering tasks into one coordinated operation significantly increases throughput while keeping the laser source and control system unified rather than requiring separate lasers for each chip

The patent applies local quality by assigning different light transmittance characteristics to different portions of the mask corresponding to different chip positions. Each light-transmissive portion is designed with specific transmittance properties tailored to the power requirements of chips at those positions, allowing optimized soldering quality for each chip type without requiring dynamic power adjustment during the batch soldering process

The patent performs preliminary action by pre-configuring the mask with appropriate light transmittance properties for different chip positions before the soldering process begins. This advance preparation eliminates the need for real-time power adjustments during batch soldering, ensuring that each chip receives the correct power level from the start and preventing damage to red-light chips while maintaining high processing speed