Masked Multi-Head Micro Transfer for Precise Large-Substrate Placement

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Solution Overview

Problem

Existing micro device transfer technologies face inefficiencies in transferring multiple micro devices to large-scale substrates, requiring improved methods for selective and rapid transfer to enhance productivity.

Innovation Solution

A micro device transfer apparatus and method utilizing multiple transfer head units with a mask unit and light emitting parts to selectively expose and separate micro devices from a carrier substrate, allowing for precise placement on a target substrate, with gantry frames and moving modules for efficient positioning and alignment.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If multiple transfer head units are used to transfer micro devices simultaneously, then productivity is improved, but device complexity increases

Engineering Contradiction:
Improvetransfer efficiencyVSAvoidapparatus structure
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The transfer apparatus is divided into multiple independent transfer head units (first, second, third, and fourth transfer head units), each capable of independently transferring micro devices. This segmentation allows simultaneous operation of multiple heads, thereby improving productivity while maintaining manageable complexity through modular design

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Each transfer head unit is designed with universal functionality to perform the same transfer operation on different regions of the target substrate. The multiple transfer head units can be interchangeably positioned and operated, providing multi-functionality that enhances productivity without requiring fundamentally different mechanisms for each head

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Manufacturing precision

If mask unit with opening part and shielding part is used to selectively expose micro devices, then manufacturing precision is improved, but device complexity increases

Engineering Contradiction:
Improveselective placement precisionVSAvoidmask unit structure
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The mask unit is segmented into distinct opening parts and shielding parts, where opening parts allow light to pass through to expose specific micro devices for transfer, while shielding parts block light to protect other micro devices. This segmentation enables precise selective exposure and placement of micro devices at desired locations on the target substrate

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The mask unit acts as an intermediary component between the light source and the micro devices on the carrier substrate. By positioning the mask unit to selectively block or transmit light, it mediates the exposure process to achieve precise control over which micro devices are transferred, thereby improving manufacturing precision

Inventive Principle:
Principle #24Intermediary (Mediator)

3Manufacturing precision

If multiple gantry frames with moving modules are used for positioning, then manufacturing precision is improved, but device complexity increases

Engineering Contradiction:
Improvepositioning accuracyVSAvoidpositioning system structure
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The positioning system is segmented into multiple independent gantry frames (first and second gantry frames), each equipped with its own moving module. This segmentation allows each gantry frame to independently control the positioning of its associated transfer head units, improving positioning accuracy through distributed control while managing complexity through modular architecture

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The gantry frames are designed with moving modules that enable dynamic positioning and adjustment of the transfer head units. The moving modules allow the gantry frames to move along predetermined paths and adjust positions in real-time, providing the flexibility and precision needed for accurate micro device placement while maintaining a relatively simple mechanical structure

Inventive Principle:
Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach significantly reduces work time and enhances the efficiency of transferring micro devices onto large-scale target substrates by enabling precise and simultaneous placement across multiple regions, improving overall transfer efficiency.

Implementation Method 1

a light emitting part disposed on the mask unit, the light emitting part emitting active light to the carrier substrate through the mask unit

Methodology Applied
Scientific EffectLight emission: Light

Implementation Method 2

the mask unit including a mask including an opening part and a shielding part, the opening part of the mask unit exposing some of the plurality of micro devices disposed on the carrier substrate fastened to the carrier substrate fastening part, and the shielding part of the mask unit shielding a rest of the plurality of micro devices

Methodology Applied
Scientific EffectOptical absorption: Absorption (EM radiation)

Data Source

PatentUS11784081B2Micro device transfer apparatus and method
Publication Date: 2023.10.10 SAMSUNG DISPLAY CO LTD
  • US11784081B2 patent drawing
  • US11784081B2 patent drawing
  • US11784081B2 patent drawing

AI summary

A micro device transfer apparatus and a micro device transfer method are provided. The micro device transfer apparatus comprises a stage unit including a stage where a target substrate is to be disposed, a plurality of transfer head units disposed above the stage, and a transfer head unit moving part configured to move the plurality of transfer head units, wherein, the transfer head unit comprises a carrier substrate fastening part configured to fasten a carrier substrate where a plurality of micro devices are disposed, a mask unit disposed above the carrier substrate fastening part, the mask unit comprising a mask including an opening part and a shielding part, a light emitting part disposed on the mask unit, and a housing formed around the carrier substrate fastening part, the mask unit, and the light emitting part.