Maskless Deposition for Large OLED Substrates
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Solution Overview
Problem
The existing deposition methods for organic light-emitting display apparatuses face challenges in manufacturing larger substrates due to mask distortion and lengthy processing times, particularly when using fine metal masks, which hinder high-definition patterning and efficient production.
Innovation Solution
A method involving a deposition apparatus where the substrate and deposition assembly move relative to each other, using a patterning slit sheet smaller than the substrate, with an interval measuring assembly to ensure precise alignment and uniform deposition, allowing for continuous deposition and improved manufacturing efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a fine metal mask is used for deposition on large substrates, then deposition pattern formation is achieved, but the mask bends due to gravity causing pattern distortion
Solution Approach 1:
The patent removes the fine metal mask from the deposition system entirely, extracting the problematic component that caused mask bending and pattern distortion. Instead of using a mask, the invention employs a shadow maskless deposition technique where the deposition source directly patterns material onto the substrate through controlled movement and positioning, eliminating the structural instability issue associated with large masks.
Solution Approach 2:
The patent replaces the mechanical mask system with a controlled deposition source movement system. Instead of relying on a physical mask to define patterns, the invention uses precise positioning and movement of the deposition source relative to the substrate, substituting mechanical mask structures with a dynamically controlled deposition process that achieves patterning without physical masks.
2Manufacturing precision
If a fine metal mask is used for deposition, then pattern formation is achieved, but alignment and separation processes are time-consuming
Solution Approach 1:
The patent eliminates the mask component entirely, removing the need for time-consuming mask alignment and separation operations. By adopting a maskless deposition approach, the process streamlines production by directly patterning materials through controlled source movement, bypassing the multi-step mask handling procedures that reduce manufacturing efficiency.
Solution Approach 2:
The patent enables continuous deposition and patterning operations without interruption for mask alignment or separation. The deposition source moves continuously relative to the substrate, maintaining uninterrupted material deposition and pattern formation, thereby eliminating the cyclic downtime associated with mask handling and improving overall manufacturing throughput.
3Area of stationary object
If a large mask is used for large substrates, then full substrate coverage is achieved, but mask distortion occurs due to gravity
Solution Approach 1:
The patent removes the large mask structure entirely, eliminating the component that suffers from gravitational distortion. The maskless deposition system achieves full substrate coverage through controlled movement of the deposition source and appropriate positioning, covering the entire substrate area without requiring a large physical mask that would bend under its own weight.
Solution Approach 2:
The patent transitions from a static mask structure to a dynamic deposition process. Instead of relying on a fixed, large mask that must maintain its shape against gravity, the invention uses a movable deposition source that can dynamically position and deposit material across the entire substrate area, achieving full coverage through motion rather than static structure.
4Manufacturing precision
If close contact between mask and substrate is required for deposition, then deposition uniformity is achieved, but contact-related defects occur
Solution Approach 1:
The patent removes the physical mask that requires close contact with the substrate, eliminating the source of contact-related defects such as contamination, mechanical damage, or adhesion issues. The maskless deposition system achieves deposition uniformity through controlled source-to-substrate distance and movement, maintaining consistent material flux across the substrate without physical contact.
Solution Approach 2:
The patent replaces the mechanical contact-based deposition system with a non-contact deposition approach. Instead of requiring the mask to physically touch the substrate for uniform deposition, the invention uses a controlled non-contact deposition source that maintains a consistent distance from the substrate through positioning control, achieving uniform material distribution without mechanical contact and its associated defects.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables mass production of large substrates with high-definition patterning, reduces manufacturing time, and increases yield by avoiding mask distortion and contact-related defects, while maintaining deposition uniformity.
Implementation Method 1
depositing a deposition material that is emitted from a deposition assembly by relatively moving the substrate with respect to the deposition assembly
Data Source
AI summary
A method of manufacturing an organic light emitting display apparatus, and an organic light emitting display apparatus manufactured by the method, the method being suitable for mass producing a large substrate, enabling high-definition patterning, and allowing controlling of a distance between a patterning slit sheet and a substrate which are moved relative to each other.