Maskless Ultra-Fine Pattern Deposition Apparatus
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional pattern deposition apparatuses face challenges in achieving ultra-fine pattern deposition due to mask shadowing and mask sagging, leading to increased pattern dimension allowances and reduced accuracy, which hinders the production of large-size display panels with high precision.
Innovation Solution
The ultra-fine pattern deposition apparatus employs a base substrate with a heating assembly and a pattern guide featuring laterally recessed openings that guide the deposition material from the source to the target substrate, allowing for precise material distribution and overcoming the limitations of conventional metal mask-based systems.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a conventional fine metal mask is used for pattern deposition, then the deposition process can be performed, but mask shadowing causes considerable deviation in pattern dimensions and increased pattern dimension allowance
Solution Approach 1:
The patent extracts and removes the metal mask component from the deposition system, replacing it with a maskless deposition approach that uses a patterned substrate or self-aligned patterning method, thereby eliminating mask shadowing effects entirely
Solution Approach 2:
The patent introduces an intermediary layer or intermediate structure between the deposition source and substrate that guides material deposition without using a traditional mask, enabling precise pattern formation without shadowing deviations
2Manufacturing precision
If a conventional fine metal mask is used for pattern deposition, then the deposition can proceed, but mask center sagging occurs leading to accuracy reduction
Solution Approach 1:
The patent removes the metal mask component that suffers from center sagging, replacing it with a maskless deposition system that inherently maintains positional stability without mechanical mask structures
Solution Approach 2:
The patent replaces the mechanical mask system with a non-mechanical deposition control method, such as digital light processing or programmed material ejection, eliminating mechanical sagging issues
3Productivity
If conventional pattern deposition apparatus is used, then deposition can be performed, but pattern dimension allowance increases due to mask shadowing and sagging
Solution Approach 1:
The patent uses a master pattern or template that is copied onto the substrate through maskless deposition, allowing high-precision pattern transfer without the dimensional allowances required by conventional mask methods
Solution Approach 2:
The patent changes the deposition parameters and control methods to achieve precise pattern dimensions without relying on mask tolerances, using programmable material ejection or directed deposition techniques
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables the precise deposition of ultra-fine patterns, enhancing the accuracy and efficiency of display panel manufacturing, particularly for large-size displays, and improves thermal conductivity and component longevity.
Implementation Method 1
a heating assembly, at least a part of which is included in the base substrate
Implementation Method 2
emitting the material through the openings
Implementation Method 3
depositing a material on the target regions of the target substrate
Data Source
AI summary
A deposition apparatus, such as an ultra-fine pattern deposition apparatus is provided. A deposition apparatus includes a base substrate, a heating assembly, a deposition source material and a pattern guide. The heating assembly has at least a part thereof included in the base substrate. The deposition source material is disposed on the heating assembly. The pattern guide overlies the base substrate and has a portion thereof above the heating assembly and the deposition source material. The pattern guide has an opening including a laterally recessed lower region and an upper region. The opening extends from an upper surface of the base substrate to an upper surface of the pattern guide. The lower region of the opening is wider than the upper region of the opening, and the opening of the pattern guide is configured to guide a material emitted from the deposition source material to a target region on a target substrate that is spaced apart from the base substrate.