Maskless Evaporation Deposition for OLED Subpixel Patterning
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Solution Overview
Problem
The manufacturing of high-definition and large-area organic light emitting display devices using fine metal masks (FMMs) is challenging due to limitations in forming light emitting layers for each subpixel, leading to reduced yield, increased manufacturing costs, and shortened product lifespan.
Innovation Solution
An apparatus for manufacturing organic light emitting display devices without using a deposition pattern mask like FMM, utilizing multiple deposition chambers with evaporation sources to discharge light emitting materials onto a substrate with inclined surfaces, allowing for self-aligned deposition of organic light emitting layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If fine metal mask (FMM) is used for deposition to form organic light emitting layer for each subpixel, then manufacturing precision of light emitting layer pattern is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent extracts and removes the FMM component from the deposition system. Instead of using a fine metal mask for pattern deposition, the invention employs a maskless deposition approach where the organic light emitting layer is deposited directly onto the substrate without requiring a physical mask, thereby eliminating the complexity associated with FMM handling, alignment, and replacement
Solution Approach 2:
The patent replaces the mechanical FMM system with a controlled deposition field system. By using precisely controlled evaporation sources and deposition conditions, the pattern formation is achieved through field-based control rather than mechanical mask positioning, reducing device complexity while maintaining manufacturing precision
2Manufacturing precision
If fine metal mask (FMM) is used for deposition, then light emitting layer formation for each subpixel is achieved, but productivity decreases and manufacturing cost increases
Solution Approach 1:
By removing the FMM from the process, the patent eliminates the time-consuming mask replacement and alignment steps that limit productivity. The maskless deposition enables continuous manufacturing without interruption for mask changes, significantly improving manufacturing throughput while maintaining subpixel-level precision
Solution Approach 2:
The patent performs preliminary substrate preparation and patterning of underlying layers before deposition, so that the organic light emitting layer can be deposited directly without requiring a mask during the deposition process itself. This preliminary structuring of the substrate enables high-speed deposition while maintaining precise subpixel formation
3Manufacturing precision
If fine metal mask (FMM) is used for deposition, then light emitting layer pattern is formed, but product lifespan is reduced due to suboptimal deposition
Solution Approach 1:
The patent replaces the mechanical mask-based deposition with a controlled field-based deposition system that provides more uniform and optimized material distribution. This substitution allows for better control of deposition parameters such as angle, rate, and uniformity, resulting in superior light emitting layer quality and extended product lifespan
Solution Approach 2:
The patent optimizes deposition parameters including evaporation rate, deposition angle, and substrate temperature to achieve optimal light emitting layer formation. By carefully controlling these parameters without the constraints of FMM geometry, the invention achieves both precise patterning and enhanced layer quality that improves device reliability and lifespan
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables effective formation of emission layers, improving the yield and reducing manufacturing costs, while extending product lifespan and enhancing display performance in terms of power consumption, luminance, and high-definition capabilities.
Implementation Method 1
a first evaporation source configured to discharge a third light emitting material for forming a third organic light emitting device through a first nozzle
Data Source
AI summary
An apparatus for manufacturing an organic light emitting display device can comprise a first deposition chamber, a second deposition chamber and a third deposition chamber.The first deposition chamber can comprise a first evaporation source configured to discharge a third light emitting material for forming a third organic light emitting device through a first nozzle disposed to face a separation area between adjacent stripe patterns on a substrate having a plurality of stripe patterns. The second deposition chamber can comprise a second evaporation source configured to discharge a first light emitting material for forming a first organic light emitting device through a second nozzle disposed to face a first area of the stripe pattern. The third deposition chamber can comprise a third evaporation source configured to discharge a second light emitting material for forming a second organic light emitting device through a third nozzle disposed to face a second area of the stripe pattern.The second nozzle and the third nozzle can be inclined in directions opposite to each other with respect to the moving direction of the substrate.