Maskless Exposure Apparatus Stitching Stripe Elimination

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Solution Overview

Problem

Maskless exposure apparatuses face challenges in achieving uniform exposure across large substrates due to limited exposure width in the sub-scan direction, leading to stitching areas where adjacent exposure heads overlap, resulting in stitching stripes and non-uniform exposure doses.

Innovation Solution

A maskless exposure apparatus with a stage, exposure head, beam measurer, calculator, and controller that measures beam data, calculates step distances to ensure uniform exposure dose distribution, and aligns exposure heads to minimize stitching stripes by determining an optimal step distance within a tolerance range.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If multiple exposure heads are used to cover large substrates, then the exposure area is increased, but stitching stripes appear in the overlapping areas due to non-uniform exposure dose

Engineering Contradiction:
Improveexposure areaVSAvoidexposure dose uniformity
Core Design Contradiction:
Area of stationary objectVSManufacturing precision

Solution Approach 1:

The patent applies preliminary action by measuring beam data (position, power, size) before the stitching exposure process and calculating the optimal step distance in advance. The controller uses these pre-calculated parameters to position exposure heads and adjust beam intensity, ensuring uniform exposure dose in stitching areas before the actual exposure begins, thereby preventing stitching stripe formation.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent implements parameter changes by dynamically adjusting the step distance between exposure heads and beam intensity based on measured beam characteristics. The controller modifies exposure parameters (positioning coordinates, beam power) to compensate for variations in stitching areas, maintaining uniform exposure dose across the entire substrate including overlapping regions.

Inventive Principle:
Principle #35Parameter changes

2Area of stationary object

If the exposure width is increased to cover large substrates, then the number of exposure heads is reduced, but the beam spot array size must be enlarged which reduces resolution

Engineering Contradiction:
Improveexposure widthVSAvoidpattern precision
Core Design Contradiction:
Area of stationary objectVSManufacturing precision

Solution Approach 1:

The patent resolves this contradiction by transitioning from a single-dimension approach (enlarging beam spot array) to a multi-dimensional solution. It maintains small beam spot arrays for high resolution while extending coverage in the sub-scan direction through multiple exposure heads with optimized step distances. The system achieves large area coverage by adding spatial arrangement of multiple heads rather than enlarging individual beam spots.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent applies segmentation by dividing the large substrate into multiple exposure regions covered by separate exposure heads, each maintaining high resolution with small beam spot arrays. The segmentation allows each head to operate at optimal resolution while the coordinated stepping and overlapping of multiple heads achieve comprehensive high-resolution coverage of the entire large substrate.

Inventive Principle:
Principle #1Segmentation

3Area of stationary object

If stepping is performed in the sub-scan direction to cover the entire substrate, then the exposure area is increased, but stitching areas with overlapping exposure create non-uniform dose distribution

Engineering Contradiction:
Improvecoverage areaVSAvoidexposure dose uniformity
Core Design Contradiction:
Area of stationary objectVSManufacturing precision

Solution Approach 1:

The patent implements feedback by measuring actual beam data (position, power, size) from each exposure head and using this information to calculate and adjust step distances. The controller receives feedback from beam measurements and dynamically optimizes positioning and exposure parameters to ensure uniform dose distribution in stitching areas, compensating for variations introduced by the stepping process.

Inventive Principle:
Principle #23Feedback

Data Source

PatentUS9019471B2Maskless exposure apparatus and stitching exposure method using the same
Publication Date: 2015.04.28 SAMSUNG ELECTRONICS CO LTD
  • US9019471B2 patent drawing
  • US9019471B2 patent drawing
  • US9019471B2 patent drawing

AI summary

Disclosed herein are a maskless exposure apparatus configured to perform exposure by tilting a beam spot array with respect to a scan direction (Y-axis direction) thus preventing stitching stripes and a stitching method using the same. A step distance, in which exposure dose uniformity in a stitching area is within a tolerance range, is calculated using actual position data of beam spots constituting the beam spot array on an exposure plane, and if necessary, using beam power data and/or beam size data. As exposure is performed based on image data conforming to the step distance, the stitching area has a uniform exposure dose, enabling exposure without stitching stripes.