Maskless Photolithography Light Guide Emission Points
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Solution Overview
Problem
Photolithography faces challenges in accurately registering features across wide areas, particularly in building devices with multiple layers, due to limitations in registration between layers and registration area limitations, which affects the precise deposition of materials like metallic layers on sub-micron scale optical features.
Innovation Solution
A device comprising a light source and a light guide with emission points that emit photoresist-curable electromagnetic radiation, such as UV light, by frustrating total internal reflection, allowing for precise exposure and patterning of photoresist on a substrate, enabling accurate registration of nanoscale features across large areas.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a patterned photomask is used for photolithography exposure, then the photoresist can be accurately patterned, but registration between multiple layers becomes difficult and the registration area is limited
Solution Approach 1:
The patent uses a photomaskless approach where the pattern is directly written onto the photoresist using a focused light source and computational algorithms, eliminating the physical photomask. This digital copying method allows for precise pattern transfer without the registration limitations of physical masks, enabling accurate alignment across multiple layers through software-based coordinate transformation and field stitching
Solution Approach 2:
The system dynamically adjusts exposure parameters, light source positioning, and pattern generation in real-time during the photolithography process. The light source can be moved and repositioned dynamically to write patterns across the entire substrate area, and the system adapts to different layer requirements by dynamically changing exposure conditions and pattern data for each layer
2Adaptability or versatility
If a new layer is added to a device with multiple layers, then device functionality is enhanced, but registration of features with the top layer becomes increasingly difficult
Solution Approach 1:
The patent divides the exposure process into multiple fields that are stitched together to cover the entire substrate area. Each field can be independently optimized for registration with the top layer, and the computational system integrates these segmented exposures into a complete pattern. This segmentation allows each layer to be addressed independently while maintaining overall registration accuracy
Solution Approach 2:
The patent replaces the mechanical photomask alignment system with a computational approach that uses software-based pattern generation and coordinate transformation. This eliminates mechanical registration limitations and allows for precise alignment of multiple layers through digital calculations and adaptive pattern adjustment
3Manufacturing precision
If photolithography is used to deposit sub-micron scale features, then device precision is improved, but the registration area is limited
Solution Approach 1:
The patent extends the registration capability from two-dimensional mask patterns to three-dimensional spatial control of the light source. By controlling the light source position, angle, and focal point in three dimensions, the system can write high-precision patterns across the entire substrate area, overcoming the area limitations of flat photomasks
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances the ability to register nanoscale features across wide areas, improving the precision of material deposition and overcoming registration limitations in multi-layer device fabrication, enabling the creation of complex patterns and structures.
Implementation Method 1
The light guide is arranged to receive the photoresist-curative electromagnetic radiation from the light source and to guide the received radiation by total internal reflection
Implementation Method 2
the emission points emitting the photoresist-curative electromagnetic radiation out of the light guide by frustration of total internal reflection caused by the emission points
Implementation Method 3
The light exposed photoresist is then developed to create patterned photoresist with voids therein
Data Source
AI summary
A device (100) includes a light source (130) and a light guide (110). The light source (130) is configured to emit photoresist-curative electromagnetic radiation. The light guide (110) is arranged to receive the photoresist-curative electromagnetic radiation from the light source (130) and to guide the received radiation by total internal reflection, the light guide (110) including a pattern of emission points (210) on at least one surface of the light guide (110), the emission points (210) emitting the photoresist-curative electromagnetic radiation out of the light guide (110) by frustration of total internal reflection caused by the emission points (210).