Maskless Lithography Apparatus Multi-Beam Parallel Writing

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

The increasing complexity and cost of photolithography equipment, particularly in e-beam patterning of semiconductor substrates, result in low productivity and long processing times, necessitating improvements in lithography equipment and throughput.

Innovation Solution

A maskless lithography apparatus with multiple writing chambers, each equipped with a multi-beam module providing multiple radiation beams and a data path for synchronized circuit pattern data distribution, enhances productivity by allowing simultaneous writing across multiple substrates and reducing data communication costs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If multiple writing chambers are used to increase throughput, then productivity is improved, but device complexity increases

Engineering Contradiction:
Improvelithography patterning throughputVSAvoidapparatus structure complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The lithography apparatus is divided into multiple independent writing chambers (first writing chamber, second writing chamber, etc.), each capable of processing substrates simultaneously. This segmentation allows parallel processing of multiple substrates, thereby increasing overall throughput while maintaining manageable complexity through modular design

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Multiple writing chambers share common infrastructure including vacuum systems, control systems, and data processing pathways. Each chamber is universally equipped with multi-beam modules capable of writing different circuit patterns, allowing the system to handle diverse lithography tasks across multiple chambers simultaneously

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Productivity

If circuit pattern data is provided to multiple writing chambers, then simultaneous writing is enabled, but data communication overhead increases

Engineering Contradiction:
Improvesimultaneous substrate writing capabilityVSAvoiddata communication costs
Core Design Contradiction:
ProductivityVSLoss of information

Solution Approach 1:

Multiple writing chambers share a common data processing infrastructure and control system. The circuit pattern data is distributed through a unified data pathway that serves all writing chambers, eliminating the need for separate data communication channels for each chamber and reducing overall data communication overhead

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The system uses a single set of circuit pattern data that is copied and distributed to multiple writing chambers simultaneously. This allows the same lithography pattern information to be used across multiple chambers without requiring independent data generation for each chamber, reducing data communication requirements

Inventive Principle:
Principle #26Copying

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The apparatus significantly improves lithography patterning throughput and reduces tool overhead, enabling efficient and synchronized pattern writing across multiple substrates, thereby addressing the productivity and cost challenges of existing photolithography systems.

Implementation Method 1

a multi-beam module operable to provide multiple radiation beams each directed for writing a portion of the substrate

Methodology Applied
Scientific EffectElectron beam: Electron Beam

Data Source

PatentUS8143602B2High-volume manufacturing massive e-beam maskless lithography system
Publication Date: 2012.03.27 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
  • US8143602B2 patent drawing
  • US8143602B2 patent drawing
  • US8143602B2 patent drawing

AI summary

The present disclosure provides a maskless lithography apparatus. The apparatus includes a plurality of writing chambers, each including: a wafer stage operable to secure a wafer to be written and a multi-beam module operable to provide multiple radiation beams for writing the wafer; an interface operable to transfer wafers between each of the writing chambers and a track unit for processing an imaging layer to the wafers; and a data path operable to provide a set of circuit pattern data to each of the multiple radiation beams in each of the writing chambers.