Maskless Micro-Nano Structure Arrays With Wire Electrode Patterning
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Solution Overview
Problem
Current micro-nano processing technologies face limitations in achieving feature sizes below a few microns, particularly with traditional Mask Electrochemical Machining (TMECM), which requires frequent mask remaking, generates hydrogen bubbles, and produces safety hazards due to high-pressure electrolyte flow, and multi-beam laser interference processing results in poor surface roughness and high equipment costs.
Innovation Solution
A method using a trimming wire electrode and multi-beam laser interference to create cross-size micro-nano structure arrays without a mask, employing ultrashort pulse power supply and controlled electrochemical processes to achieve precise electrochemical dissolution or deposition, allowing for large-area processing with improved safety and reduced costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional Mask Electrochemical Machining (TMECM) is used to prepare microstructure arrays, then surface quality is improved (no burrs, no heat-affected zone), but the process cycle is prolonged due to frequent mask remaking and material waste is generated
Solution Approach 1:
The patent extracts and removes the mask component from the TMECM process, transitioning to a maskless electrochemical machining approach where the tool electrode directly defines the microstructure pattern, eliminating mask remaking steps and material waste
Solution Approach 2:
The patent makes the tool electrode serve multiple functions: it acts as both the machining tool and the pattern definition element, replacing the separate mask component and enabling direct preparation of microstructure arrays with high aspect ratios
2Manufacturing precision
If traditional TMECM with hydrophobic photoresist or PDMS masks is used for microstructure preparation, then pattern definition is achieved, but hydrogen bubble discharge is suppressed when feature size is reduced to about 10 microns
Solution Approach 1:
The patent replaces the mechanical mask system (photoresist or PDMS) with an electrochemical field-based approach, where the tool electrode and electrolyte interaction defines the pattern and enables effective hydrogen bubble discharge through electrolyte flow and electrochemical reactions
3Area of stationary object
If traditional TMECM is used to prepare large-area microtexture, then large-area processing is achieved, but high-pressure and high-speed electrolyte flow is required causing safety hazards
Solution Approach 1:
The patent introduces dynamic control of electrolyte flow and tool electrode movement, using controlled relative motion between the tool electrode and workpiece to maintain efficient electrolyte circulation and hydrogen bubble discharge without requiring high-pressure flow, thereby reducing safety hazards
4Adaptability or versatility
If multi-beam laser interference processing is used to prepare micro textures, then different types and sizes of micro textures can be achieved, but surface roughness is poor due to heat-affected zone
Solution Approach 1:
The patent replaces the laser thermal processing system with an electrochemical machining system, where material removal occurs through electrochemical reactions rather than thermal ablation, eliminating the heat-affected zone and achieving superior surface quality with fine micro-nano structures
5Manufacturing precision
If ultrashort pulse micro electrochemical machining is used, then machining accuracy is improved to submicrometers, but output power limitation prevents large-area processing
Solution Approach 1:
The patent segments the large-area processing task into multiple passes with the tool electrode, using reciprocating motion and controlled electrolyte flow to progressively process different regions, enabling large-area coverage while maintaining submicrometer accuracy through ultrashort pulse electrochemical machining
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the precise preparation of large-area metal micro-nano structure arrays with high localization and anisotropic control, improving machining accuracy, safety, and reducing costs by eliminating the need for high-speed electrolyte flow and achieving high aspect ratios with enhanced bonding strength.
Implementation Method 1
the workpiece undergoes electrochemical dissolution or electrochemical deposition at the corresponding position of the trimming wire electrode
Implementation Method 2
the workpiece undergoes electrochemical dissolution or electrochemical deposition at the corresponding position of the trimming wire electrode
Implementation Method 3
outputting multi-beam laser interference to irradiate the surface of the workpiece
Implementation Method 4
Multi-beam laser interference processing technology is a special form of laser processing technology
Data Source
AI summary
A method for preparing a cross-dimension micro-nano structure array includes: S1. providing a workpiece immersed in the electrolyte as the first electrode, providing a trimming wire electrode as the second electrode and setting it above the workpiece, providing an interference beam adjuster and outputting multi-beam laser interference to irradiate the surface of the workpiece; S2. The power supply between the first electrode and the second electrode forms a loop, and drives the trimming wire electrode to reciprocate relative to the workpiece, and the workpiece undergoes electrochemical dissolution or electrochemical deposition at the corresponding position of the trimming wire electrode, and form a micro-nano structure array without a mask, and solves the problem of low output power of the existing ultrashort pulse power supply, improves the processing accuracy of the micro-nano structure array, does not require electrolyte for high-speed flow, and improves system safety and reduce the cost.