Master Alloy Sputtering Target Composition Control
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Solution Overview
Problem
Existing methods for producing alloys with high melting point and low boiling point components face challenges in maintaining compositional control due to volatilization issues during melting, leading to uncontrollable alloy composition and defects in sputtering targets.
Innovation Solution
A master alloy comprising specific combinations of elements like Ta, W, Ru, Mo, Nb, Hf, Cr, Mn, Co, Ni, Ti, and V is used, with a composition ratio of 50.0 to 80.0 at % Y, forming intermetallic compounds or solid solutions to suppress volatilization and ensure uniformity, allowing for the production of sputtering targets with controlled composition and reduced defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If melting method is used to produce alloy, then alloy can be formed, but compositional control becomes uncontrollable due to volatilization of low boiling point component
Solution Approach 1:
The alloy production process is divided into two separate stages: first forming a master alloy of X and Y components, then mixing this master alloy powder with additional X component powder before sintering. This segmentation prevents direct melting of the final alloy composition, avoiding volatilization of the low boiling point Y component while maintaining compositional control.
Solution Approach 2:
The master alloy is prepared in advance with the desired Y component content before being processed further. By pre-forming the master alloy and then mechanically mixing it with X component powder, the Y component is protected from volatilization that would occur during high-temperature melting of the final alloy composition.
2Stability of the object's composition
If master alloy with high Y component content is used, then compositional uniformity is improved, but volatility of Y component increases during melting
Solution Approach 1:
The process separates the formation of the master alloy (which can have high Y content for uniformity) from the final alloy production. The master alloy is made with sufficient Y content to ensure uniformity, then ground and mixed with X component powder, avoiding the need to melt the final high-Y composition and thus preventing volatilization.
Solution Approach 2:
The master alloy powder acts as an intermediary carrier of the Y component. Instead of adding Y component directly during final alloy melting (where it would volatilize), the Y component is first incorporated into the master alloy matrix, then transferred to the final product through mechanical mixing and sintering, protecting it from volatilization.
3Productivity
If conventional melting method is used, then production speed is maintained, but compositional uniformity and defect reduction are compromised
Solution Approach 1:
The conventional thermal field (melting) is replaced with a mechanical field approach: the master alloy is ground into powder, mixed mechanically with X component powder, and then sintered. This mechanical substitution allows for better compositional control and uniformity while maintaining production efficiency through the streamlined powder metallurgy process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The approach results in sputtering targets with high-density, uniform alloy compositions and few defects, enabling the deposition of alloy barrier films with uniform quality and reduced particle presence at high speeds.
Implementation Method 1
forming intermetallic compounds or solid solutions to suppress volatilization
Implementation Method 2
forming intermetallic compounds or solid solutions to suppress volatilization
Implementation Method 3
enabling the deposition of an alloy barrier film with uniform quality
Data Source
AI summary
Provided is a master alloy for a sputtering target, wherein, when elements constituting the master alloy are following X1, X2, Y1, Y2, Y2, and Y3; specifically, where X1 is one or two types of Ta or W; X2 is at least one type of Ru, Mo, Nb or Hf; Y1 is one or two types of Cr or Mn; Y2 is one or two types of Co or Ni; and Y3 is one or two types of Ti or V, the master alloy comprises any one combination of X1-Y1, X1-Y2, X1-Y3, X2-Y1, and X2-Y2 of the foregoing constituent elements. The present invention consequently yields superior effects of being able to obtain a sintered sputtering target with few defects and having a high-density and uniform alloy composition, and, by using this target, to realize the deposition of an alloy barrier film with uniform quality and few particles at a high speed.