Master System Controller for Laser Annealing Precision
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Solution Overview
Problem
High pulse repetition rate laser systems, such as excimer or molecular fluorine gas discharge lasers, require better control for surface treatment of materials with amorphous silicon layers to achieve efficient crystallization for thin film transistor production in flat panel displays, particularly in low temperature polysilicon processes and thin beam sequential lateral solidification systems.
Innovation Solution
A pulsed DUV workpiece treatment apparatus and method utilizing a Master System Controller (MSC) architecture that includes a laser controller, work stage controller, and system controller to maintain precise parameters for a narrow beam of light pulses, with a database-driven process controller and graphical user interface for recipe definition and execution, ensuring customized process control and error handling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If high pulse repetition rate laser systems are used for surface treatment, then productivity is improved, but control precision deteriorates
Solution Approach 1:
The control system is segmented into multiple independent controllers: a master system controller (MSC) that coordinates overall process parameters, individual laser controllers for each laser unit, and a work stage controller for substrate positioning. This segmentation allows each controller to specialize in specific parameters, maintaining precision while enabling high pulse repetition rates through parallel operation.
Solution Approach 2:
The system implements feedback control mechanisms where the master system controller continuously monitors beam parameters and adjusts laser operation in real-time. Process sensors detect deviations in beam width, energy distribution, or pulse timing, and the controller modifies subsequent pulses to maintain specification compliance, enabling both high speed and precision.
2Manufacturing precision
If narrow beam parameters are maintained for precise crystallization, then manufacturing precision is improved, but device complexity increases
Solution Approach 1:
The master system controller serves multiple functions simultaneously: it coordinates laser pulse timing, monitors beam parameters, controls work stage positioning, manages process recipes, and handles error conditions. This multi-functionality consolidates what could be separate complex systems into a single coordinated controller, maintaining precision while managing complexity through functional integration.
Solution Approach 2:
The master system controller acts as an intermediary between the laser system, work stage, and process specifications. It translates high-level process requirements into specific control commands for subordinate controllers, and aggregates sensor data into unified process state information. This intermediary layer simplifies the control architecture by providing a single point of coordination rather than direct complex interconnections between all system components.
3Adaptability or versatility
If customized process control is implemented for different users, then adaptability is improved, but device complexity increases
Solution Approach 1:
The system enables process customization through parameter changes in control software rather than hardware modifications. Users can adjust beam width, pulse energy, repetition rate, and scanning speed parameters through the master controller's software interface. The controller manages multiple sets of process parameters for different materials and desired outcomes, switching between them as needed without increasing physical system complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables precise control of high pulse repetition rate laser systems for efficient crystallization of amorphous silicon, improving the production of thin film transistors by maintaining narrow beam parameters and handling errors effectively, thus enhancing the throughput and adaptability of the laser annealing process.
Implementation Method 1
delivering light to irradiate the workpiece, for crystallization of a material on the workpiece
Implementation Method 2
crystallization of a material on the workpiece, which may comprise a pulsed laser DUV light source and an optical train producing a very narrow width very elongated beam of light pulses
Data Source
AI summary
A pulsed DUV workpiece treatment apparatus and method for delivering light to irradiate the workpiece, for crystallization of a material on the workpiece, carried on a work stage, which may comprise a pulsed laser DUV light source and an optical train producing a very narrow width very elongated beam of light pulses with a set of parameters required to be maintained within a respective selected narrow range of values on a pulse to pulse basis is disclosed, which may comprise: a laser controller; a work stage controller; a system controller receiving process recipe control demands from a customer recipe control command generator and providing control signals to the laser controller and the workstage controller, which may comprise: a database driven process controller which may comprise: a database containing generic process command steps selectable by a user through an external process user interface.