High-Frequency Matching Circuit Layout for Harmonic Attenuation

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Solution Overview

Problem

High frequency modules with multiple circuits face challenges in downsizing and improving circuit characteristics without increasing complexity, as existing techniques require multiple components or large inductive elements to achieve desired harmonic wave attenuation.

Innovation Solution

The configuration of adjacent matching circuits that electromagnetically couple each other, allowing one matching circuit to perform both impedance matching and harmonic wave attenuation, thereby reducing the number of elements and element constants required, and compensating for each other's limitations to achieve desired circuit characteristics.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If additional filter circuits are added to achieve harmonic wave attenuation, then the attenuation performance is improved, but the device complexity and overall size increase

Engineering Contradiction:
Improveharmonic wave attenuation performanceVSAvoidcircuit configuration complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The matching circuit is designed to perform multiple functions simultaneously: impedance matching and harmonic wave attenuation. By configuring the matching circuit with specific element arrangements (such as series and parallel LC combinations), it achieves both matching performance and filter functionality without requiring separate dedicated filter circuits, thereby reducing overall device complexity while maintaining attenuation effectiveness

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent combines the matching circuit and filter circuit into a single integrated matching circuit structure. The matching circuit includes elements arranged to create attenuation poles at harmonic frequencies, effectively merging the functions of impedance matching and harmonic suppression into one circuit block, which reduces the number of components and simplifies the overall circuit configuration

Inventive Principle:
Principle #5Merging (Combining)

2Reliability

If larger inductive elements are used to achieve desired attenuation characteristics, then the circuit characteristics are improved, but the overall module size increases

Engineering Contradiction:
Improvecircuit characteristicsVSAvoidmodule size
Core Design Contradiction:
ReliabilityVSVolume of moving object

Solution Approach 1:

The patent optimizes the parameters of circuit elements (inductance values, capacitance values, and their arrangements) to achieve the desired attenuation characteristics with smaller physical component sizes. By carefully selecting and arranging elements with specific parameter values, the circuit achieves effective harmonic attenuation without requiring large inductive elements, thus maintaining compact module dimensions

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The matching circuit elements are arranged in a nested or compact configuration where series and parallel LC combinations are integrated closely together. This nesting approach allows the circuit to achieve the required electrical characteristics with reduced physical footprint, as the elements are optimally positioned to maximize their electromagnetic interaction while minimizing overall space requirements

Inventive Principle:
Principle #7Nested doll (Nesting)

3Volume of moving object

If the number of circuit elements is reduced to downsize the module, then the overall size is reduced, but the circuit characteristics deteriorate

Engineering Contradiction:
Improvemodule sizeVSAvoidcircuit characteristics
Core Design Contradiction:
Volume of moving objectVSReliability

Solution Approach 1:

The matching circuit is designed to perform multiple functions simultaneously: impedance matching and harmonic wave attenuation. By configuring the matching circuit with specific element arrangements (such as series and parallel LC combinations), it achieves both matching performance and filter functionality without requiring separate dedicated filter circuits, thereby reducing overall device complexity while maintaining attenuation effectiveness

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent optimizes the parameters of circuit elements (inductance values, capacitance values, and their arrangements) to achieve the desired attenuation characteristics with smaller physical component sizes. By carefully selecting and arranging elements with specific parameter values, the circuit achieves effective harmonic attenuation without requiring large inductive elements, thus maintaining compact module dimensions

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables the creation of a high frequency module with a small overall size and excellent circuit characteristics by eliminating the need for additional filters and reducing insertion losses, while maintaining effective harmonic wave attenuation.

Implementation Method 1

the first matching circuit and the second matching circuit are arranged adjacent to one another in such a manner as to attenuate a harmonic wave of a signal traveling through the first matching circuit

Methodology Applied
Scientific EffectElectromagnetic coupling: Electromagnetic Induction

Data Source

PatentUS11043924B2High frequency module and communication device
Publication Date: 2021.06.22 MURATA MFG CO LTD
  • US11043924B2 patent drawing
  • US11043924B2 patent drawing
  • US11043924B2 patent drawing

AI summary

A high frequency module includes a first amplifier circuit, a second amplifier circuit, a first matching circuit connected to the first amplifier circuit, and a second matching circuit connected to the second amplifier circuit, wherein the first matching circuit and the second matching circuit are arranged adjacent to each another. The first matching circuit may be provided on an output side of the first amplifier circuit.