Matrix Image Capture Module With Integrated LEDs and Photodetectors
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Solution Overview
Problem
Current image capture devices that combine optical capture and light emission functions lack efficient integration of photodetectors and light-emitting diodes, leading to suboptimal performance in interactive display applications such as motion detection and face recognition.
Innovation Solution
A mixed image capture device comprising a transfer substrate with elementary monolithic electronic chips, each equipped with photodetectors and electronic circuits using MOS transistors, and organic light-emitting diodes, where the chips are connected to the substrate for control and arranged in a matrix for interleaved functionality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If photodetectors and light-emitting diodes are integrated in current image capture devices, then the device can perform both optical capture and light emission functions, but the integration efficiency is suboptimal leading to poor performance in interactive display applications
Solution Approach 1:
The device is divided into multiple elementary chips, each containing a photodetector and associated electronic circuits. These chips are arranged in a matrix on the transfer substrate, allowing independent optimization of each chip's functionality while achieving system-level versatility for both image capture and light emission operations
Solution Approach 2:
Each elementary chip merges the photodetector sensor function with electronic control circuits into a single integrated unit. This combination is achieved by forming MOS transistors and photodetectors in and on a layer of monocrystalline silicon, creating a unified chip that performs both sensing and control operations
2Reliability
If elementary chips are arranged in a matrix on the transfer substrate, then the device achieves efficient integration and improved performance, but the device complexity increases
Solution Approach 1:
Each elementary chip is designed as a universal unit that can perform both photodetection and light emission functions through its integrated circuits. The chips are interconnected via the transfer substrate to form a matrix that operates as a cohesive system, reducing overall device complexity through standardized modular design
Solution Approach 2:
The transfer substrate serves as an intermediary component that facilitates the connection between multiple elementary chips. It provides the electrical interconnection network that enables the chips to function together as an integrated matrix while maintaining physical separation and modular organization
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the device's ability to capture images and emit light effectively, improving performance in interactive applications like motion detection and face recognition by integrating photodetectors and LEDs efficiently.
Implementation Method 1
each elementary chip comprising at least one photodetector
Implementation Method 2
the emission, capture or actuation element comprises at least one light-emitting diode
Data Source
Figure 1A(a)~1C
Figure 1D~1F
Figure 1G~1J
AI summary
This description relates to a device comprising: - a carrier substrate (200) having electrical connection elements; and - a plurality of elementary chips (153) fixed and electrically connected to the carrier substrate (200), each elementary chip (153) having at least one photodetector and an electronic circuit for reading said at least one photodetector, - the device further comprising, associated with at least one elementary chip (153), an external emission, capture or actuation element (LR, LG, LB) fixed and electrically connected to the carrier substrate (200), each elementary chip (153) having an electronic circuit for controlling the emission, capture or actuation element (LR, LG, LB) associated with the chip.