Matrix LED Package Layout for Visibility and Heat Isolation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing light-emitting device packages face challenges in ensuring forward visibility during dimming control and suffer from heat generation issues, which can degrade reliability and increase the complexity of structural design.
Innovation Solution
A semiconductor device package with a matrix arrangement of semiconductor structures of different sizes, connected via wiring lines and pads, and a driving unit configuration that allows for independent time-division control and effective heat dissipation, including a substrate with a passivation layer and separate driving units for improved visibility and reduced heat impact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If dimming control is performed to prevent driver dazzle, then driver safety is improved, but forward visibility is degraded
Solution Approach 1:
The light-emitting device is divided into multiple independently controllable light-emitting chips arranged in a matrix pattern. This segmentation allows different regions to be controlled separately, enabling dimming control in specific areas to prevent dazzle while maintaining full illumination in other areas for forward visibility.
Solution Approach 2:
Different control strategies are applied to different regions of the light-emitting device. The matrix arrangement with independent chip control enables local quality adjustment where certain chips are dimmed or turned off to prevent dazzle in specific directions while other chips remain fully illuminated to maintain forward visibility.
2Adaptability or versatility
If multiple functions are integrated into one package, then device versatility is improved, but structural complexity is increased
Solution Approach 1:
The light-emitting device package integrates multiple light-emitting chips that can perform different functions simultaneously. The matrix arrangement with independent control capability allows the same physical structure to serve multiple purposes such as illumination, signaling, and adaptive lighting functions.
Solution Approach 2:
Multiple light-emitting chips and control circuits are merged into a single integrated package with a unified substrate. This combining approach achieves multiple functions in one device while the systematic matrix arrangement keeps the internal structure organized and manageable.
3Reliability
If heat dissipation is improved, then reliability is improved, but device structure becomes more complex
Solution Approach 1:
The driving unit is separated from the light-emitting chip array and positioned at a distance, extracting the heat-generating component away from the sensitive light-emitting elements. This spatial separation reduces thermal impact on the chips while maintaining electrical connection through wiring lines.
Solution Approach 2:
Wiring lines serve as intermediaries to transmit electrical signals from the driving unit to the light-emitting chips while also acting as thermal isolation elements. The wiring lines enable electrical connection while maintaining spatial separation that facilitates heat dissipation.
Data Source
AI summary
Disclosed in an embodiment are a semiconductor device and a light-emitting device package including same, the semiconductor device comprising: a substrate; a plurality of semiconductor structures arranged in a matrix shape in the central area of the substrate; passivation layers arranged on upper surfaces and lateral surfaces of the semiconductor structures and on the edge area of the substrate; a plurality of first wiring lines which are arranged at lower parts of the plurality of semiconductor structures and electrically connected thereto, and which include first end parts extending from the central area to the edge area of the substrate; a plurality of second wiring lines which are arranged at the lower parts of the plurality of semiconductor structures and electrically connected thereto, and which include second end parts extending from the central area to the edge area of the substrate; a plurality of first pads penetrating the passivation layer so as to be connected to the plurality of first end parts; and a plurality of second pads penetrating the passivation layers so as to be connected to the plurality of second end parts, wherein the plurality of semiconductor structures include a plurality of first semiconductor structures, which are arranged in a first area of the central area, and a plurality of second semiconductor structures, which are arranged in a second area of the central area, and the size of the plurality of first semiconductor structures differs from the size of the plurality of second semiconductor structures.