Matrix Sensor Layout for Reconfigurable Wafer Temperature Mapping
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Solution Overview
Problem
Current in situ wafer temperature measurement systems for semiconductor fabrication have high sensor density, which is not easily reconfigurable, requiring a new design if sensors need to be rearranged, and face issues with thermal expansion and material degradation at high temperatures.
Innovation Solution
A process condition measurement apparatus with a substrate featuring a matrix of interconnect traces and sensors that are individually readable, using insulation portions to mitigate thermal stress and material degradation, and allowing for customizable sensor placement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If sensors are fixed in standard locations with high sensor density, then across-wafer temperature monitoring capability is improved, but reconfigurability deteriorates
Solution Approach 1:
The sensor array is segmented into individually addressable sensors arranged in a matrix pattern, allowing selective activation and configuration of specific sensors based on measurement needs while maintaining high overall sensor density for comprehensive temperature monitoring
Solution Approach 2:
The sensor configuration transitions from fixed to dynamically reconfigurable through individual sensor addressing, enabling the system to adapt sensor locations and density according to different measurement requirements without physical repositioning
2Adaptability or versatility
If an entirely new design is created for sensor reconfiguration, then sensor placement flexibility is improved, but device complexity and manufacturing cost deteriorate
Solution Approach 1:
A single sensor array design serves multiple configuration needs through individual sensor addressing, eliminating the requirement for multiple specialized designs and reducing overall system complexity while maintaining placement flexibility
3Measurement precision
If high sensor density is used, then temperature monitoring accuracy is improved, but thermal stress and material degradation worsen
Solution Approach 1:
Insulation portions are strategically placed at specific locations within the sensor array to provide localized thermal protection where needed, allowing high sensor density in monitored areas while mitigating thermal stress through targeted insulation rather than uniform coverage
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables flexible sensor configuration based on customer needs and environmental conditions, optimizing sensor density and reducing thermal stress and material degradation, thus enhancing the reliability and adaptability of temperature measurement systems.
Implementation Method 1
The first plurality of interconnect traces and the second plurality of interconnect traces may intersect at a plurality of locations to form a matrix of interconnect junctions across one or more locations of the substrate. A respective sensor may electrically couple to a respective trace of the first plurality of interconnect traces and a respective trace of the second plurality of interconnect traces.
Implementation Method 2
one or more insulation portions disposed on the substrate... one or more insulation portions where the one or more insulation portions are configured over the first plurality of interconnect traces... allowing for customizable sensor placement... reducing thermal stress and material degradation
Data Source
AI summary
A process condition measurement apparatus is disclosed. The apparatus includes a substrate, one or more insulation portions, a first plurality of interconnect traces, a second plurality of interconnect traces, and a plurality of sensors disposed on the substrate. The second plurality of interconnect traces is disposed over the first plurality of interconnect traces and intersects at a plurality of locations to form a matrix of interconnect junctions across one or more locations of the substrate. A respective sensor is electrically coupled to a respective trace of the first and second plurality of interconnect traces. The respective sensor is individually readable by addressing the respective trace of the first and second plurality of interconnect traces.