Matrix Thermal Sensing Circuit for Dynamic Fan Control
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Solution Overview
Problem
Conventional heat-dissipation systems in electronic devices often inefficiently dissipate heat and consume unnecessary energy due to the use of a single thermal sensor controlling multiple fans, leading to suboptimal performance and increased noise.
Innovation Solution
A matrix thermal sensing circuit with multiple sensing nodes and a fan control circuit that adjusts the operating parameters of fan units positioned around a circuit board based on the thermal state of each load element, optimizing heat dissipation by sensing working currents and determining thermal states to control fan speed dynamically.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single thermal sensor controls multiple fans, then the control system is simple, but heat dissipation efficiency is poor and energy consumption is high
Solution Approach 1:
The patent divides the circuit board into multiple thermal zones, each monitored by its own thermal sensor. This segmentation allows independent control of fan groups based on localized thermal conditions, improving heat dissipation efficiency without requiring a completely complex centralized control system.
Solution Approach 2:
The patent implements localized thermal monitoring and control by assigning specific thermal sensors to specific thermal zones and controlling specific fan groups based on each zone's thermal state. This local quality approach ensures that heat dissipation is optimized for each region independently, preventing energy waste in cool areas while adequately cooling hot spots.
2Productivity
If fans operate at highest speed, then heat dissipation is maximized, but power consumption and noise increase
Solution Approach 1:
The patent implements dynamic fan speed control by adjusting fan rotation speeds based on real-time thermal sensor readings. Fans operate at variable speeds rather than fixed high speed, matching the cooling capacity to actual thermal conditions. This dynamic adjustment optimizes heat dissipation efficiency while minimizing unnecessary energy consumption and noise during low-thermal-load periods.
Solution Approach 2:
The patent changes the operating parameters of fans based on thermal conditions by adjusting rotation speed as a variable parameter. The system monitors thermal states and dynamically modifies fan speed parameters to achieve optimal heat dissipation with minimal energy consumption, avoiding continuous operation at maximum speed.
3Device complexity
If multiple fans are controlled by a single thermal sensor, then the control system is simple, but unnecessary energy is consumed
Solution Approach 1:
The patent segments the control system into multiple independent control channels, each with its own thermal sensor and fan group. This segmentation prevents energy waste by ensuring that only fan groups corresponding to thermal zones with actual heating loads are activated, while other fan groups remain inactive or operate at minimal speed.
Solution Approach 2:
The patent applies local quality control by matching thermal monitoring and cooling activation to specific localized areas. Each thermal zone is independently monitored and controlled, preventing unnecessary energy consumption in areas that do not require cooling while ensuring adequate cooling where heat is generated.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances heat dissipation efficiency while reducing energy consumption and noise by dynamically adjusting fan speeds according to localized thermal conditions, improving the overall performance of electronic devices.
Implementation Method 1
Each sensing node is electrically connected to a current feeding terminal of one corresponding load element and senses the working current of the corresponding load element
Implementation Method 2
The calculation module is connected to the current sensing module and used to determine the thermal state of the location of the sensing node according to the working current
Implementation Method 3
cooling fans are set in the electronic system to exhaust heat air generated by the heat source outside of the electronic system via convection
Data Source
AI summary
A heat-dissipation system and a matrix thermal sensing circuit are provided. The heat-dissipation is used in an electronic device. The electronic device comprises a circuit board and a plurality of load elements disposed on the circuit board. The matrix thermal sensing circuit includes a current sensing module and a calculation module. The current sensing module includes a plurality of sensing nodes. Each sensing node is electrically connected to a current feeding terminal of one corresponding load element, and senses the working current of the corresponding load element respectively. The calculation module is connected to the current sensing module and is used to determine thermal state of the location of the sensing node according to the working current respectively.