Matrix Wiring Substrate Layout for Multi-Microchip Mini LED Backlights
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Solution Overview
Problem
The development of Mini LED backlight substrates is hindered by the need for different wiring distributions for various microchips, leading to increased development cycles and costs, as well as complexity in sharing masks and intermediate substrates, which complicates the process and reduces productivity.
Innovation Solution
A wiring substrate with a specific arrangement of control regions, device regions, and via holes is designed, allowing for flexible connection of different microchips by using a base substrate, metal wiring layers, and insulating material layers, enabling the creation of multiple array substrates with shared processes and materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If different wiring distributions are designed for various microchips, then the electrical connection requirements of different microchips are met, but the development cycle and cost increase, and the process complexity increases
Solution Approach 1:
The substrate is divided into multiple control regions arranged in a matrix, with each control region containing four device regions that can be independently configured. This segmentation allows different microchips to be placed in different control regions with their specific wiring requirements, while other regions can maintain standardized designs, thus reducing overall process complexity.
Solution Approach 2:
The substrate design incorporates a universal matrix structure with control regions that can accommodate multiple microchip types. The standardized control region framework serves as a universal platform, while the flexible device region configuration within each control region allows adaptation to different microchip wiring requirements, achieving both universality and adaptability.
2Adaptability or versatility
If different wiring distributions are designed for various microchips, then the electrical connection requirements of different microchips are met, but the development cost increases
Solution Approach 1:
By segmenting the substrate into standardized control regions with flexible internal device region configurations, the design allows reuse of the same substrate framework across multiple microchip types. Only the device region connections within each control region need customization, significantly reducing the quantity of unique design work and associated costs.
Solution Approach 2:
The substrate is pre-configured with a standardized matrix of control regions and device regions before microchip placement. This preliminary structuring allows for efficient planning and reduction of customization work, as the framework is already in place and only requires connection establishment rather than complete redesign for each microchip type.
3Adaptability or versatility
If different wiring distributions are designed for various microchips, then the electrical connection requirements of different microchips are met, but the productivity decreases
Solution Approach 1:
The segmented control region design allows for modular manufacturing where standardized control regions can be produced using the same process and masks, while only the device region interconnections require customization. This significantly improves production efficiency compared to complete custom designs for each microchip type.
Solution Approach 2:
The universal control region framework enables a single substrate design to support multiple microchip types, allowing for high-volume production of the standardized framework that can then be adapted to different applications, thereby maintaining high productivity while achieving versatility.
4Adaptability or versatility
If masks and intermediate substrates cannot be shared, then the specific wiring requirements for each microchip are met, but the development cycle increases
Solution Approach 1:
By dividing the substrate into standardized control regions that can use common masks and intermediate substrates, the design enables sharing of manufacturing resources across different microchip types. Only the device region connection layers require customization, significantly shortening the development cycle compared to complete custom designs.
Solution Approach 2:
The universal control region framework serves as a common platform that can be used across multiple microchip projects, allowing masks and intermediate substrates to be shared. This universality reduces redundant development work and accelerates the overall development cycle while still accommodating specific wiring requirements through device region customization.
Data Source
AI summary
The present disclosure relates to the field of display technology, and provides a wiring substrate, an array substrate, and a light emitting module. The wiring substrate includes a base substrate, a first metal wiring layer, and an insulating material layer stacked in sequence. The first metal wiring layer is provided with a plurality of drive leads extending along a first direction, and the insulating material layer is provided with a plurality of via holes exposing the drive leads. Through adjusting positions of the drive leads and positions of the via holes, the wiring substrate can be applied to different microchips, and used further to prepare different array substrates.