Matte Finish Polyimide Films for Electronic Component Protection
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Solution Overview
Problem
Current coverlay films for electronic components are either too thick, costly, or compromise on dielectric and optical properties, making them inadequate for protecting electronic materials while preventing visual inspection and tampering.
Innovation Solution
A base film with a chemically converted polyimide, a non-carbon black pigment, and a particulate polyimide matting agent, which reduces the amount of matting agent needed for low gloss, enhancing mechanical properties and dielectric strength while maintaining optical security.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional coverlay films are used to protect electronic components, then protection is provided, but the films are too thick and costly while compromising dielectric and optical properties
Solution Approach 1:
The patent changes the chemical parameters of the polyimide film by using a chemically converted polyimide matrix with specific pigment concentrations (2-35 wt%) and matting agent amounts (1.6-20 wt%), achieving optimal protection with reduced thickness. The chemical conversion process modifies the polymer structure to enhance both protective properties and optical characteristics simultaneously.
2Reliability
If conventional coverlay films are used, then protection is provided, but dielectric strength and mechanical properties are compromised
Solution Approach 1:
The patent creates a composite material system consisting of a chemically converted polyimide matrix combined with specific pigment particles and matting agents. This composite structure achieves enhanced dielectric strength (greater than 1400 V/mil) and mechanical properties while maintaining protective functions, resolving the contradiction between protection quality and material strength.
3Reliability
If conventional films are used for optical security, then visual inspection prevention is achieved, but cost increases
Solution Approach 1:
The patent applies local quality by using a non-uniform distribution of pigments and matting agents within the film structure. The chemically converted polyimide matrix provides localized optical density variations that effectively prevent visual inspection of conductor traces, while the controlled concentration ranges optimize cost efficiency by avoiding excessive material usage.
4Illumination intensity
If high concentration of matting agent is used to achieve matte finish, then low gloss is achieved, but mechanical properties and dielectric strength decrease
Solution Approach 1:
The patent optimizes the concentration parameter of matting agents to a specific range (1.6-20 wt%, preferably 2.0-10.0 wt%) in the chemically converted polyimide matrix. This parameter optimization achieves the desired matte finish (low gloss) while maintaining excellent mechanical properties and dielectric strength, resolving the contradiction between surface appearance and material strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in a thinner, cost-effective coverlay film with improved mechanical and dielectric properties, achieving a matte finish on both sides and effective optical density for hiding conductor traces, thus providing enhanced protection and security.
Implementation Method 1
a chemically converted polyimide, the chemically converted polyimide being derived from: a) at least 50 mole percent of an aromatic dianhydride, based upon a total dianhydride content of the chemically converted polyimide, and b) at least 50 mole percent of an aromatic diamine based upon a total diamine content of the chemically converted polyimide
Data Source
AI summary
The present disclosure is directed to a base film having a chemically converted polyimide, a non-carbon black pigment and a particulate polyimide matting agent. The particulate polyimide matting agent is present in an amount from 1.6 to 9 weight percent of the base film.