MAX MX Materials for IC Conductive Pathways

Solution Overview

Problem

The challenge in integrated circuit (IC) devices is scaling conductive materials to smaller sizes while maintaining high-reliability conductive pathways, as traditional materials like copper face limitations in conductivity and reliability at smaller dimensions.

Innovation Solution

The use of MAX and MX materials, such as layered hexagonal carbides and nitrides, which exhibit both metallic and ceramic characteristics, offering high electrical conductivity, thermal shock resistance, and low thermal expansion coefficients, allowing for the formation of thin layers suitable for small-scale IC devices, replacing traditional conductive materials like copper in contacts and interconnects.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If traditional conductive materials like copper are scaled to smaller sizes, then device miniaturization is achieved, but conductivity and reliability deteriorate

Engineering Contradiction:

Improvedevice sizeVSAvoidconductive pathway reliability

Core Design Contradiction:

Volume of moving objectVSReliability

Solution Approach 1:

The patent changes the material parameter from traditional copper to MAX phase materials (such as Ti3AlC2, Ti4AlN3) which maintain high electrical conductivity and reliability even at scaled dimensions. These materials exhibit metallic bonding characteristics with conductivity comparable to or exceeding copper, while providing superior thermal stability and mechanical strength at nanoscale dimensions.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent employs MAX phase materials which are inherently composite in nature, consisting of early transition metals (M), group 13-16 elements (A), and carbon or nitrogen (X) in a layered hexagonal structure. This composite structure combines metallic conductivity with ceramic-like thermal stability and mechanical strength, resolving the contradiction between miniaturization and reliability.

Inventive Principle:

Principle #40Composite materials

2Volume of moving object

If traditional conductive materials like copper are scaled to smaller sizes, then device miniaturization is achieved, but conductivity deteriorates

Engineering Contradiction:

Improvedevice sizeVSAvoidelectrical conductivity

Core Design Contradiction:

Volume of moving objectVSReliability

Solution Approach 1:

The patent changes the material parameter from traditional copper to MAX phase materials (such as Ti3AlC2, Ti4AlN3) which maintain high electrical conductivity and reliability even at scaled dimensions. These materials exhibit metallic bonding characteristics with conductivity comparable to or exceeding copper, while providing superior thermal stability and mechanical strength at nanoscale dimensions.

Inventive Principle:

Principle #35Parameter changes

3Manufacturing precision

If thin layers of conductive materials are formed for small-scale devices, then device scaling is achieved, but material reliability deteriorates

Engineering Contradiction:

Improvelayer thicknessVSAvoidconductive pathway reliability

Core Design Contradiction:

Manufacturing precisionVSReliability

Solution Approach 1:

The patent changes the material parameter from traditional copper to MAX phase materials which maintain high electrical conductivity and reliability even at scaled dimensions. These materials exhibit metallic bonding characteristics with conductivity comparable to or exceeding copper, while providing superior thermal stability and mechanical strength at nanoscale dimensions.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent employs MAX phase materials which are inherently composite in nature, consisting of early transition metals (M), group 13-16 elements (A), and carbon or nitrogen (X) in a layered hexagonal structure. This composite structure combines metallic conductivity with ceramic-like thermal stability and mechanical strength, resolving the contradiction between miniaturization and reliability.

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

MAX and MX materials provide enhanced conductivity and reliability in IC devices, enabling efficient electrical pathways and thermal management, suitable for next-generation small-scale IC applications.

Implementation Method 1

MAX materials exhibit both metallic and ceramic characteristics under various conditions. Of particular interest for IC devices, MAX materials have high electrical conductivity due to the metallic-like nature of their bonding.

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 2

They also have high thermal shock resistance, damage tolerance, machinability, elastic stiffness, and low thermal expansion coefficients.

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentEP4203065A1Integrated circuits with max or MX conductive materials

Publication Date: 2023.06.28 INTEL CORP

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AI summary

Described herein are integrated circuit devices with conductive regions formed from MX or MAX materials. MAX materials are layered, hexagonal carbides and nitrides that include an early transition metal (M) and an A group element (A). MX materials remove the A group element. MAX and MX materials are highly conductive, and their two-dimensional layer structure allows very thin layers to be formed. MAX or MX materials can be used to form several conductive elements of IC circuits, including contacts, interconnects, or liners or barrier regions for contacts or interconnects.