MCM Interface Adapter Chiplet for Non-Matching PHY Integration
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Solution Overview
Problem
Chiplet-based architectures for multi-chip modules (MCMs) face increased costs due to expensive packaging components and processes, particularly for larger integrated circuit chips, which negatively impact yield and overall manufacturing costs.
Innovation Solution
The implementation of interface adapter circuitry, including interface adapter chiplets, that establishes a common physical interface (PHY) between IC chips with non-matching interfaces, allowing for interconnection of multiple chiplets using less costly non-silicon substrates and enabling 2.5D and 3D packaging architectures, thereby reducing device costs without compromising performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If chiplet-based architectures are used for multi-chip modules, then manufacturing yield is improved, but device cost increases due to expensive packaging components and processes
Solution Approach 1:
An interface adapter chiplet is introduced as an intermediary component between first and second IC chips with non-matching interfaces. The adapter chiplet includes first interface circuitry that interfaces with the first IC chip and second interface circuitry that interfaces with the second IC chip, enabling communication between chips that would otherwise be incompatible. This mediator approach allows the use of cost-effective non-silicon substrates while maintaining high signaling rates, thus improving yield through modular chiplet architecture without incurring the full cost penalty of traditional packaging solutions.
2Adaptability or versatility
If interface adapter circuitry is implemented to enable interconnection of chiplets with non-matching interfaces, then adaptability is improved, but device complexity increases
Solution Approach 1:
The interface adapter functionality is segmented into a separate, dedicated chiplet rather than being integrated into the main IC chips. This segmentation allows the adapter chiplet to be independently designed, manufactured, and positioned between the first and second IC chips. The adapter chiplet contains specialized first interface circuitry and second interface circuitry that can be optimized for their respective interface requirements, thereby achieving high adaptability for different interface types while keeping the overall packaging structure manageable through modular assembly.
Data Source
AI summary
Semiconductor devices, packaging architectures and associated methods are disclosed. In one embodiment, a multi-chip module (MCM) is disclosed. The MCM includes a package substrate and a first integrated circuit (IC) chip disposed on the package substrate. The first IC chip includes first core circuitry, and first interface circuitry for communicating with the first core circuitry. A second IC chip is disposed on the package substrate and includes second core circuitry and second interface circuitry for communicating with the second core circuitry. The second interface circuitry exhibits a non-matching interface with respect to the first interface circuitry. Interface adapter circuitry couples to the first interface circuitry and the second interface circuitry to establish a common physical interface (PHY) for communicating between the first core circuitry and the second core circuitry.