Multi-Chip Module Optical Multiplexing for Data Throughput
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Solution Overview
Problem
Current telecom switches face challenges in scalability and data traffic throughput due to limited optical input/output ports and increased complexity in managing multiple optical signals with different wavelengths, which restricts the upscaling of data traffic beyond 12.8 Tb/s.
Innovation Solution
A multi-chip module (MCM) architecture that integrates photonic chips with electronic chips to directly multiplex multiple electrical data lanes into a smaller number of optical lanes sharing the same wavelength, using photonic modulator-segments to upscale the modulation format of electrical data to a higher-order modulation format for optical data, thereby reducing the number of optical channels and complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple optical channels with different wavelengths are used to increase data traffic throughput, then the data rate is improved, but the device complexity and management complexity increase
Solution Approach 1:
The patent changes the wavelength parameter from multiple different wavelengths to a single shared wavelength (1550 nm), and changes the modulation format parameter from simple to higher-order modulation. This allows multiple electrical lanes to be multiplexed onto fewer optical channels, increasing throughput while reducing the complexity of managing multiple wavelengths
Solution Approach 2:
The patent transitions from managing multiple optical channels in the wavelength domain to managing multiple electrical lanes in the electrical domain that are then multiplexed onto fewer optical channels. This dimensional shift from optical wavelength multiplexing to electrical-lane multiplexing simplifies system management while maintaining high throughput
2Productivity
If the number of optical input/output ports is increased to handle higher data traffic, then the data rate is improved, but the scalability is limited by physical constraints
Solution Approach 1:
The patent merges multiple electrical data lanes into a smaller number of optical lanes by using higher-order modulation formats. This consolidation allows the system to achieve higher throughput without proportionally increasing the number of optical ports, thereby improving scalability and overcoming physical constraints on port expansion
3Productivity
If higher-order modulation formats are used to increase data rate per optical channel, then the productivity is improved, but the peak driving electrical voltage increases
Solution Approach 1:
The patent segments the modulation process across multiple photonic modulator segments (e.g., multiple Mach-Zehnder modulators) that are driven by multiple electrical lanes. Each segment handles a portion of the modulation, distributing the voltage requirements across multiple lower-voltage drivers rather than requiring a single high-voltage driver, thus enabling higher-order modulation while controlling peak voltage
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach increases data rate per optical channel by up to a factor of M, reduces the required number of optical channels, and lowers peak driving electrical voltage, enabling higher data traffic throughput without increasing system complexity or cost.
Implementation Method 1
two or more photonic modulator-segments coupled to each of the optical channels, each photonic modulator-segment configured to modulate the propagating optical signals responsively to digitally modulated driving electrical signals provided thereto
Data Source
AI summary
A multi-chip module (MCM-10) includes a substrate (11), one or more photonic chips (14) disposed on the substrate, and an electronic chip (12) disposed on the substrate. The one or more photonic chips include one or more optical channels (22), which are configured to guide propagating optical signals, and two or more photonic modulator-segments (18) coupled to each of the optical channels, each photonic modulator-segment configured to modulate the propagating optical signals responsively to digitally modulated driving electrical signals provided thereto. The electronic chip is configured to generate the digitally modulated driving electrical signals on multiple different lanes (16) of the electronic chip, synchronize the driving electrical signals on the multiple lanes to a same clock, separately control respective phases of the driving electrical signals, fine-tune the voltages of the driving electrical signals on the multiple lanes, and drive the photonic modulator-segments on the photonic chips with the synchronized and phase-controlled driving electrical signals.


