MCM Socket Layout for Compact Co-Packaged Optics Modules
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Solution Overview
Problem
As bandwidth requirements increase, the number of high-speed channels and power consumption in electronic modules rise, leading to increased substrate size and production challenges such as manufacturing yields, warpage, and PCB assembly issues due to the expansion of ball grid arrays.
Innovation Solution
A multi-chip module (MCM) with a centrally positioned main die and peripherally positioned sockets that mechanically and electrically connect mezzanine packages, including co-packaged optics (CPO) and copper (CPC) packages, allowing extensions beyond the MCM substrate periphery to maintain a compact size while supporting multiple connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If the number of electrical connections provided by ball grid arrays is increased to accommodate increased power consumption and bandwidth requirements, then the power consumption and bandwidth capacity are improved, but the overall substrate size increases
Solution Approach 1:
The patent positions the main die on the central portion of the MCM substrate and places MCM sockets on the peripheral portion, utilizing the periphery region for additional connections. This spatial arrangement allows the mezzanine package substrate to extend beyond the MCM substrate periphery, effectively using the peripheral dimension to accommodate extra electrical connections without increasing the central substrate area.
Solution Approach 2:
The mezzanine package substrate is designed to extend beyond the peripheral portion of the MCM substrate, creating a nested configuration where the mezzanine package encompasses part of the MCM structure. This nesting allows additional ball grid arrays on the mezzanine package to provide extra electrical connections while sharing the overall package footprint.
2Productivity
If the number of electrical connections provided by ball grid arrays is increased to accommodate increased power consumption and bandwidth requirements, then the bandwidth capacity is improved, but the overall substrate size increases
Solution Approach 1:
The patent utilizes the peripheral portion of the MCM substrate to position MCM sockets, allowing the mezzanine package substrate to extend beyond the MCM substrate periphery. This peripheral extension provides additional space for ball grid arrays and electrical connections, increasing bandwidth capacity without expanding the central MCM substrate area.
Solution Approach 2:
The mezzanine package substrate extends beyond the peripheral portion of the MCM substrate, creating a nested structure where the mezzanine package contains additional ball grid arrays for high-speed channels. This nesting configuration enables increased bandwidth capacity while maintaining a compact overall footprint by utilizing the peripheral extension rather than expanding the entire substrate.
3Productivity
If the substrate size is increased to accommodate more electrical connections, then the number of high-speed channels is improved, but production challenges such as manufacturing yields and substrate warpage increase
Solution Approach 1:
The patent positions MCM sockets on the peripheral portion of the MCM substrate, allowing the mezzanine package substrate to extend beyond the MCM substrate periphery. This configuration concentrates the main die and critical circuitry on the central portion, keeping the substrate size manageable and reducing warpage risks, while still accommodating multiple high-speed channels through the peripheral extension.
Solution Approach 2:
The nested configuration where the mezzanine package substrate extends beyond the MCM substrate periphery allows additional high-speed channels to be implemented on the mezzanine package's ball grid arrays without significantly increasing the overall substrate size. This reduces the substrate area that requires precise manufacturing control, thereby reducing warpage and improving manufacturing yields.
4Productivity
If the substrate size is increased to accommodate more electrical connections, then the number of high-speed channels is improved, but assembly issues increase
Solution Approach 1:
The patent utilizes the peripheral portion of the MCM substrate to position MCM sockets, allowing the mezzanine package substrate to extend beyond the MCM substrate periphery. This configuration separates the main die assembly on the central portion from the additional connection points on the periphery, simplifying the assembly process by allowing modular installation of the mezzanine package without requiring the entire substrate to be oversized.
Solution Approach 2:
The nested configuration where the mezzanine package substrate extends beyond the MCM substrate periphery enables a modular assembly approach. The main MCM can be assembled and tested independently, then the mezzanine package can be added to provide additional high-speed channels, reducing overall assembly complexity and improving ease of manufacture compared to a monolithic oversized substrate design.
Data Source
AI summary
Electronic devices, electronic modules, and methods for manufacturing electronic devices and/or electronic modules are described herein. Some embodiments of the present invention may be directed to an electronic module that includes a multi-chip module (MCM) substrate having a first surface configured to be connected to a system printed circuit board and a second surface defining a central portion and a peripheral portion. The electronic module may include a main die positioned on the central portion of the second surface of the MCM substrate and in electrical communication with electrical traces of the MCM substrate. The electronic module may include MCM sockets positioned on the peripheral portion of the MCM substrate, where each MCM socket is configured to engage and support a mezzanine package substrate such that a main portion of the mezzanine package substrate extends beyond the peripheral portion of the MCM substrate.