Multi Chip Package Heat Spreader Thermal Interface

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Solution Overview

Problem

Multi chip packages face challenges in efficiently spreading heat due to the high-speed operations of multiple semiconductor chips in a small area, leading to potential device malfunction and reduced operation efficiency.

Innovation Solution

A multi chip package design that includes a first and second chip mounted parallel on a substrate, a protective layer surrounding the chips to expose their upper surfaces, a thermal interface material on these surfaces, and a heat spreader positioned over the interface material, with an optional vertical stiffener to support the heat spreader, facilitating efficient heat transfer and distribution.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If multiple semiconductor chips are mounted in parallel on a substrate to achieve high capacity and multi-functional operations in a small area, then the package size is reduced and functionality is enhanced, but heat generation increases and heat spreading efficiency deteriorates

Engineering Contradiction:

Improvehigh capacity and multi-functional operationsVSAvoidheat generation

Core Design Contradiction:

ProductivityVSTemperature

Solution Approach 1:

The patent introduces a heat spreader positioned above the chips at a predetermined distance, transitioning heat dissipation from a two-dimensional plane (direct contact with chips) to a three-dimensional structure. This spatial arrangement allows heat to spread across a larger volume and surface area, improving thermal management while maintaining the compact multi-chip configuration.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent employs an intermediary structure (heat spreader positioned above chips) that mediates heat transfer from multiple chip surfaces. This intermediary component collects heat from various chip surfaces and distributes it across a larger area, preventing direct heat accumulation on individual chips while maintaining close proximity for efficient heat collection.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Temperature

If a heat spreader is positioned close to chip surfaces to improve heat collection efficiency, then heat spreading performance is enhanced, but the risk of damage to chips during manufacturing and assembly increases

Engineering Contradiction:

Improveheat spreading efficiencyVSAvoidchip damage risk

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The patent applies thermal interface material to the chip surfaces before mounting the heat spreader, creating a protective thermal coupling layer in advance. This preliminary action ensures optimal thermal contact while providing a buffer that prevents direct mechanical contact between the heat spreader and fragile chip surfaces, reducing damage risk during assembly and operation.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The thermal interface material serves as an intermediary substance between the chip surfaces and the heat spreader. This intermediary layer maintains close proximity for efficient heat collection while physically protecting the chips from direct contact with the heat spreader, thus reducing mechanical stress and damage risk during manufacturing and assembly processes.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Temperature

If thermal interface material is applied to ensure optimal thermal contact between chips and heat spreader, then heat transfer efficiency is improved, but the complexity of the manufacturing process increases

Engineering Contradiction:

Improveheat transfer efficiencyVSAvoidmanufacturing process complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The thermal interface material is applied to chip surfaces as a preliminary step before final heat spreader mounting. This advance preparation ensures optimal thermal contact is established early in the manufacturing process, allowing subsequent steps to focus on structural assembly rather than thermal optimization, thereby managing overall process complexity.

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enhances heat spreading efficiency, preventing device malfunction and maintaining high operation performance by effectively dissipating heat generated by the semiconductor chips.

Implementation Method 1

a thermal interface material positioned on the heat spreader and an interface of the first to third surfaces

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a heat spreader positioned on the first to third surfaces... enhances heat spreading efficiency... effectively dissipating heat generated by the semiconductor chips

Methodology Applied

Scientific EffectHeat spreading: Conduction (thermal)

Data Source

PatentUS9570370B2Multi chip package and method for manufacturing the same

Publication Date: 2017.02.14 SK HYNIX INC

AI summary

A multi chip package includes a protective layer having an upper surface that surrounds a first chip and a second chip, which are mounted over a first substrate, to expose an upper surface of the first chip and an upper surface of the second chip, a heat spreader disposed over the upper surfaces, and a thermal interface material disposed at an interface between the heat spreader and the upper surfaces.