LED Heat Dissipation via Extended MCPCB Copper Core

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Solution Overview

Problem

High-power LEDs face challenges with heat dissipation and inefficient light distribution, particularly in applications requiring high lighting levels, such as underwater fixtures, where thermal management is critical to prevent LED failure.

Innovation Solution

The use of a metal core printed circuit board (MCPCB) with a copper core extending beyond the waterproof housing to facilitate direct heat exchange with water or air, combined with a heat sink element, to radiate heat away from the LED fixture, minimizing thermal boundaries and enhancing heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Illumination intensity

If high-power LEDs are used to increase luminosity, then light output is improved, but heat generation increases causing thermal runaway and LED failure

Engineering Contradiction:
ImproveluminosityVSAvoidheat generation
Core Design Contradiction:
Illumination intensityVSTemperature

Solution Approach 1:

The patent extracts the heat dissipation function from the traditional LED housing structure by extending the MCPCB copper core beyond the waterproof housing. This allows heat to be directly transferred to the surrounding water or air environment, separating the light-generating LED component from the heat management system and enabling effective thermal runaway prevention.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent transitions from conventional planar heat dissipation surfaces to a three-dimensional extended copper core structure that protrudes from the housing. This dimensional extension creates additional heat exchange surface area in the radial direction, enabling more efficient heat transfer to the surrounding environment without increasing the LED component size.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Illumination intensity

If multiple LEDs are combined in composite light-source structures to achieve high lighting levels, then illumination is improved, but heat management complexity increases

Engineering Contradiction:
Improvelighting levelVSAvoidheat management complexity
Core Design Contradiction:
Illumination intensityVSDevice complexity

Solution Approach 1:

The patent merges the heat dissipation function with the electrical circuit board structure by using the MCPCB copper core as both the electrical connection substrate and the primary heat transfer pathway. This consolidation eliminates the need for separate heat sinks and thermal management components, simplifying the overall device structure while supporting multiple LED configurations.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The extended copper core serves multiple functions simultaneously: it provides electrical connectivity for the LEDs, acts as a heat transfer conduit, and functions as a heat exchange surface with the environment. This multi-functionality reduces the number of components needed and simplifies the thermal management system for composite light-source structures.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Ease of manufacture

If conventional LED structures are used, then manufacturing is simple, but heat dissipation efficiency is insufficient leading to LED failure

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidheat dissipation efficiency
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent modifies the physical parameters of the MCPCB copper core by extending it beyond the housing boundary. This parameter change transforms the copper core from an internal circuit board component to an external heat exchange surface, dramatically improving heat dissipation efficiency while maintaining compatibility with standard MCPCB manufacturing processes.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution effectively manages heat dissipation in LED lighting fixtures, particularly in marine applications, by providing a direct and efficient path for heat transfer into the surrounding environment, thereby increasing the reliability and performance of high-power LEDs.

Implementation Method 1

A portion of the MCPCB may extend from the transparent window so that it can be in heat exchange contact with a fluid, such as air or water

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

The copper core extending beyond the waterproof housing to facilitate direct heat exchange with water or air

Methodology Applied
Scientific EffectConvection: Convection

Implementation Method 3

combined with a heat sink element, to radiate heat away from the LED fixture

Methodology Applied
Scientific EffectThermal radiation: Thermal Radiation

Data Source

PatentUS9316387B1LED lighting devices with enhanced heat dissipation
Publication Date: 2016.04.19 SEESCAN INC
  • US9316387B1 patent drawing
  • US9316387B1 patent drawing
  • US9316387B1 patent drawing

AI summary

LED lights including a metal core printed circuit board (MCPCB) having a rear side and a front side are disclosed. At least one LED may be mounted to the front side of the MCPCB. A transparent window may be mounted and sealed to the front side of the MCPCB to enclose the LED. A portion of the MCPCB may extend from the transparent window so that it can be in heat exchange contact with water when the window of the lighting fixture is submerged in water or other fluids.