MCPCB Bottom Frame for LCD Heat Dissipation
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Solution Overview
Problem
Current liquid crystal display (LCD) modules using LED backlight units face issues with ineffective heat radiation, leading to decreased brightness and compromised display quality, and have complex fabrication processes and increased material costs due to the use of heat-transmissive adhesives, as well as exposed connecting lines that are prone to damage.
Innovation Solution
The LCD module incorporates a bottom frame formed from a metal core printed circuit board (MCPCB) that serves as both a structural support and a heat-radiation component, allowing direct placement of LEDs on its surface and integrating the backlight driving circuit, eliminating the need for additional connecting lines and simplifying the fabrication process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional PCB and separate connecting lines are used for LED mounting, then electrical connection is achieved, but heat radiation efficiency deteriorates and reliability decreases
Solution Approach 1:
The patent merges the PCB and connecting lines into a single integrated MCPCB structure. The metal core PCB incorporates embedded conductive traces that serve as both structural support and electrical connection pathways, eliminating separate connecting lines that were prone to damage while maintaining efficient heat radiation through the metal core.
Solution Approach 2:
The patent employs MCPCB (Metal Core Printed Circuit Board) as a composite material structure consisting of a metal core layer for heat dissipation, insulating layers, and conductive trace layers. This composite structure simultaneously achieves superior thermal management and electrical connectivity, resolving the contradiction between heat radiation and reliable connection.
2Reliability
If additional connecting lines and separate PCB are used, then electrical connection is established, but device complexity increases
Solution Approach 1:
The patent combines multiple functions (structural support, electrical connection, and heat dissipation) into a single MCPCB component. This integration eliminates the need for separate PCB and connecting lines, reducing assembly steps and fabrication complexity while maintaining reliable electrical connections through the integrated conductive traces.
3Temperature
If conventional PCB is used for LED mounting, then structural support is provided, but heat radiation efficiency is insufficient
Solution Approach 1:
The patent uses MCPCB with a metal core layer that provides superior thermal conductivity compared to conventional PCB materials. The metal core serves as an efficient heat sink while the surrounding insulating and conductive layers maintain manufacturability through standardized PCB fabrication processes, balancing heat radiation performance with manufacturing ease.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively radiates heat generated by LEDs, improves display quality by maintaining LED brightness, reduces material costs, and simplifies the fabrication process by integrating the backlight driving circuit directly onto the MCPCB, thereby enhancing the overall performance and reliability of the LCD module.
Implementation Method 1
The LCD module incorporates a bottom frame formed from a metal core printed circuit board (MCPCB) that serves as both a structural support and a heat-radiation component
Implementation Method 2
The backlight unit includes at least one light emitting diode
Data Source
AI summary
A liquid crystal display module includes a liquid crystal display panel and a backlight unit under the liquid crystal display panel. The backlight unit includes at least one light emitting diode. The liquid crystal display module further comprises a bottom frame surrounding the backlight unit. The bottom frame comprises a printed circuit board and the at least one light emitting diode is disposed on the printed circuit board. The liquid crystal display module also includes a main frame surrounding the liquid crystal display panel and a top frame surrounding a front edge of the liquid crystal display panel and combined with the bottom frame through the main frame.