Single MCPCB Connected LED Lamp With Integrated Wireless Control
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Solution Overview
Problem
Existing connected LED lamps require multiple printed circuit boards (PCBs) and expensive driver solutions, increasing cost and complexity.
Innovation Solution
Implementing a connected LED lamp on a single metal core printed circuit board (PCB) that integrates LEDs, an LED driver circuit, wireless connectivity, and a power supply, utilizing a microcontroller unit (MCU) for control and a helical or monopole antenna for wireless communication.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple PCBs are used for LED board, wireless module, and power board, then functional separation and reliability are improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent combines the LED driver circuit, wireless communication module, power management circuit, and control logic onto a single PCB, eliminating the need for separate LED board, wireless module, and power board. This integration reduces the number of PCBs from three to one, simplifying the overall device structure while maintaining all necessary functions through shared power supply and ground connections.
Solution Approach 2:
The single PCB is designed to perform multiple functions simultaneously: it serves as the structural base, electrical connection medium, signal transmission path, and housing for various components including LEDs, wireless module, and power circuitry. This multi-functional design eliminates the need for specialized separate boards for each function.
2Reliability
If multiple PCBs and expensive LED driver solutions are used, then functional performance is maintained, but manufacturing cost increases
Solution Approach 1:
The patent integrates the LED driver circuit directly onto the same PCB that hosts the wireless module and power management components. This consolidation eliminates the need for expensive separate driver boards and reduces component count, thereby lowering manufacturing costs while preserving LED control functionality through shared electrical connections and common ground references.
3Device complexity
If components are integrated on a single PCB, then device complexity and cost are reduced, but heat dissipation challenges increase
Solution Approach 1:
The patent implements localized thermal management by positioning heat-generating components such as LEDs and power circuitry in specific areas of the PCB, and providing dedicated thermal pathways including copper pours, thermal vias, and heat sinks in proximity to these components. This localized approach allows efficient heat dissipation from critical areas without requiring complex system-wide thermal management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Reduces cost and complexity by consolidating components onto a single PCB, enabling efficient heat dissipation and wireless control while maintaining performance.
Implementation Method 1
The LED board 102 is implemented as a 1-layer Metal Core Printed Circuit Board (MCPCB) for heat dissipation
Implementation Method 2
an antenna coupled to the MCU through a matching network
Data Source
AI summary
A lamp includes a single 1-layer metal core printed circuit board (PCB). The 1-layer metal core PCB includes a plurality of light emitting diodes (LEDs), an LED driver circuit, a microcontroller unit (MCU) providing wireless connectivity and control for the LED driver circuit, and a power supply circuit providing power for the LEDs and the MCU. The lamp includes an antenna, e.g., helical or monopole, mounted on the single 1-layer metal core PCB. Capacitor(s) and/or inductor(s) may be mounted on a bottom side of the 1-layer metal core PCB opposite a top side of the 1-layer metal core PCB on which the LEDs are mounted. The lamp is line powered. The LEDs are disposed on a periphery of a top side of the PCB and the MCU and other circuitry is disposed on the top side of the PCB inside of the periphery.