MCU Bump Stop Struts for Regular Spring Rate
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Solution Overview
Problem
Existing Micro Cellular Urethane (MCU) bump stops/spring aids in vehicle suspension systems do not produce a regular spring rate versus deflection curve, leading to irregular handling and ride quality due to undercut design causing lateral expansion during compression.
Innovation Solution
Incorporating a plurality of struts around the circumference of the MCU bump stop/spring aid, which are molded between and on the outer and inner surfaces, to support the material and create a regular spring rate progression by reducing lateral expansion and promoting consistent folding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If undercut design is used to promote folding of the bump stop material, then compression without lateral expansion is achieved, but the spring rate versus deflection curve becomes irregular
Solution Approach 1:
The bump stop is divided into multiple circumferential segments or struts that fold independently. This segmentation allows each segment to contribute to the overall folding behavior while maintaining a more consistent spring rate progression across the entire structure, resolving the irregularity caused by traditional undercut designs.
Solution Approach 2:
Different regions of the bump stop are given different structural properties through the strut design. The struts have varying thicknesses and configurations at different locations, allowing local areas to fold at different rates and contribute differently to the overall spring rate, thereby achieving regular progression despite localized folding variations.
2Ease of manufacture
If traditional bump stop design is used, then manufacturing simplicity is maintained, but performance characteristics are insufficient
Solution Approach 1:
The strut structure combines multiple functional elements into a single integrated component. The struts simultaneously provide structural support, control folding behavior, and establish spring rate characteristics, achieving improved performance without requiring multiple separate parts or complex assembly processes.
Solution Approach 2:
The invention modifies key geometric parameters of the bump stop structure, specifically the strut dimensions, angles, and distributions. By carefully selecting and optimizing these parameters during molding, the design achieves superior performance characteristics while maintaining the simplicity of single-piece manufacturing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The struts improve the performance characteristics by maintaining a constant rate versus displacement progression, resulting in a smoother ride and improved vehicle handling by minimizing rate changes during compression.
Implementation Method 1
The struts are positioned around the circumference of the MCU bump stop/spring aid and partially support the outer surfaces. The struts improve performance characteristics by maintaining a constant rate versus displacement progression, resulting in smoother ride and improved vehicle handling by minimizing rate changes during compression.
Implementation Method 2
Bump stops/spring aids are commonly designed using undercuts to promote folding of the bump stop/spring aid material. Folding of a bump stop/spring aid is particularly desirable because it allows compression of the bump stop/spring aid without lateral expansion of the bump stop/spring aid.
Data Source
AI summary
The present invention provides an improved Micro Cellular Urethane (hereinafter ‘MCU’) bump stop/spring aid having a plurality of struts adapted to level the rate transition as sections are folded onto one another. MCU bump stops/spring aids are well known in the art to assist vehicle suspension systems. More particularly, bump stops/spring aids are frequently used with vehicle suspension systems in connection with shocks and strut assemblies. These assemblies provide a comfortable ride in addition to influencing the control and handling of the vehicle. The struts are positioned around the circumference of the MCU bump stop/spring aid. The added struts between the undercuts partially support the outer surfaces of the MCU bump stop/spring aid. Struts are generally molded between the outer surfaces. Struts may also be molded on an inner surface. The plurality of struts improves upon existing technology by improving performance characteristics.