MCU Output Circuit with Precharge Control for Lower Power
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Solution Overview
Problem
High-speed operation of microcontroller units (MCUs) in control devices, such as in-vehicle MCUs, leads to significant heat generation and power consumption, necessitating techniques to reduce power consumption and heat while maintaining processing capacity without incurring extra costs for thermal countermeasures.
Innovation Solution
A control system comprising a microcontroller unit (MCU), a charging/discharging device, and an opposed MCU, where the charging/discharging device controls the voltage level at the intersection point between the MCU and the output signal line, reducing high-level and low-level output currents (IOH and IOL) by charging or discharging, thereby minimizing heat generation and power consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the MCU operates at high speed, then processing capacity is improved, but power consumption and heat generation increase
Solution Approach 1:
A charging/discharging device is introduced as an intermediary component between the MCU and the external circuit. This device controls the voltage level at the intersection point by charging or discharging capacitors, thereby reducing the output current (IOH/IOL) of the MCU during high-speed operation. The intermediary device allows the MCU to maintain high processing capacity while the charging/discharging mechanism reduces power consumption and heat generation by minimizing the current burden on the MCU pins.
2Use of energy by moving object
If the power supply voltage is lowered to reduce power consumption, then power consumption is reduced, but processing speed decreases
Solution Approach 1:
The invention applies local quality by differentiating the voltage level requirements for different parts of the system. The internal core voltage of the MCU is maintained at a higher level to ensure fast processing speed, while the output pin voltage is locally adjusted to a lower level through the charging/discharging device to reduce power consumption and heat generation. This localized voltage control allows simultaneous optimization of both speed and power efficiency.
3Temperature
If thermal countermeasures are added to the mounting substrate, then heat dissipation is improved, but manufacturing cost increases
Solution Approach 1:
The invention converts the harmful effect of high output current (which causes heat generation) into a beneficial control mechanism. By using the charging/discharging device to actively manage and reduce the output current, the system transforms potential thermal problems into an opportunity for power optimization. This approach reduces heat generation at its source rather than requiring additional thermal management components, thereby avoiding increased manufacturing costs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces power consumption and heat generation during high-speed operations, allowing for the utilization of MCU processing capacity without the need for costly thermal countermeasures on the mounting substrate.
Implementation Method 1
a charging/discharging device, and an opposed MCU, where the charging/discharging device controls the voltage level at the intersection point between the MCU and the output signal line, reducing high-level and low-level output currents (IOH and IOL) by charging or discharging
Data Source
AI summary
It is an object of the present invention to provide a technique capable of reducing power consumption of a semiconductor device even when the semiconductor device operates at high speed. The semiconductor device includes a module for outputting a signal, a delay element, a first output circuit having an input and an output, a first external terminal connected to the output of the first output circuit and to be connected to a signal wiring, and a second external terminal. The input of the first output circuit receives the signal delayed by the delay element. The second external terminal receives the signal without passing through the delay element. The signal of the second external terminal is used to change the potential level of the signal wiring to be connected to the first external terminal before the first output circuit changes the potential of the first external terminal based on the delayed signal.