Microelectrode Array Interposer Wiring Control
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Solution Overview
Problem
Current cell analysis devices face limitations in efficiently stimulating and sensing biological cells due to constraints in electrode configuration and connectivity, which affect the scalability and accuracy of signal recording and interpretation.
Innovation Solution
A computing device with a layered structure comprising microelectrode arrays (MEAs), an interposer layer for wiring connections, and circuit chips, where the controller dynamically manages electrode connections based on the number and position of electrodes for optimized stimulation and sensing, enabling flexible activation and data processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If multiple microelectrode arrays are used to increase the number of electrodes for cell stimulation and sensing, then the measurement precision and scalability of cell analysis are improved, but the device complexity and wiring connection requirements increase
Solution Approach 1:
The system divides the electrode array into multiple separate microelectrode arrays (MEAs), each with its own circuit chip. This segmentation allows independent optimization of each MEA-circuit chip unit while maintaining overall system functionality, reducing the complexity of managing a single large electrode system
Solution Approach 2:
An interposer layer is introduced as an intermediary component between the MEAs and the substrate. This interposer simplifies the wiring connections by providing a dedicated intermediate layer for signal routing, reducing the direct wiring complexity between MEAs and the substrate
2Productivity
If multiple circuit chips are connected to multiple microelectrode arrays to enhance data collection capability, then the productivity and data processing efficiency are improved, but the device complexity and connection management difficulty increase
Solution Approach 1:
The system segments the data collection function by assigning dedicated circuit chips to specific MEAs. Each circuit chip handles data from its associated MEA independently, improving processing efficiency while simplifying connection management through modular architecture
Solution Approach 2:
The controller operates in a higher dimension of abstraction by managing MEA-circuit chip connections through software-based mapping rather than direct physical wiring management. This allows flexible configuration of which MEAs connect to which circuit chips based on data collection requirements
3Ease of manufacture
If the electrode configuration is fixed to simplify manufacturing, then the ease of manufacture is improved, but the adaptability for different cell analysis applications decreases
Solution Approach 1:
The system introduces dynamic configurability through the controller, which can adaptively map MEAs to circuit chips based on application requirements. This allows the same physical hardware to be configured for different cell analysis applications without changing the manufacturing process
Solution Approach 2:
The MEAs are designed with universal electrode patterns that can serve multiple functions through software control. The same physical electrode array can be configured for different stimulation patterns, sensing configurations, and data collection strategies depending on the application
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the scalability and efficiency of cell analysis by optimizing electrode usage and signal processing, allowing for more precise and extensive data collection from biological cells.
Implementation Method 1
each MEA being configured with electrodes for stimulation and sensing of biological cells
Implementation Method 2
electrodes for stimulation and sensing of biological cells
Implementation Method 3
The interposer layer may include the electrode layer with the interposer layer and the circuit layer being connected to each other by flip-chip bonding
Data Source
AI summary
A computing device is provided. The computing device includes an electrode layer comprising a plurality of microelectrode arrays (MEAs), each MEA being configured with electrodes for stimulation and sensing of biological cells; an interposer layer comprising an interposer for a wiring connection between the plurality of MEAs and a substrate of the computing device; a circuit layer comprising a plurality of circuit chips configured to stimulate the cells and store excitement of the cells in response to the stimulation by corresponding electrodes; and a controller configured to control whether or how to connect the plurality of circuit chips to the plurality of MEAs.