Meander Transformer Layout for Isolated High-Frequency Signal Transfer
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Solution Overview
Problem
Semiconductor devices with inductive coupling for signal transmission face challenges in miniaturization due to the size requirements of the inductors and difficulty in handling high-frequency signals, as traditional photocouplers are bulky and inefficient at high frequencies.
Innovation Solution
The semiconductor device employs a transformer configuration with meander-shaped inductors to reduce size and enhance signal transmission efficiency, allowing for smaller chip area and improved high-frequency performance by inductive coupling between two inductors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional photocoupler is used for signal transmission between circuits with different potentials, then isolation is achieved, but the device size increases and high-frequency signal transmission is difficult
Solution Approach 1:
The patent replaces the mechanical/optical system of photocouplers with an electromagnetic field-based transformer system. The transformer uses magnetic coupling between primary and secondary windings to achieve signal transmission and isolation, eliminating the need for light-emitting and light-receiving elements, thereby reducing device size while maintaining isolation functionality
Solution Approach 2:
The patent changes the operating parameters by using high-permeability magnetic cores and optimized winding configurations to achieve efficient magnetic coupling at high frequencies. This allows the transformer to operate effectively in the high-frequency range where photocouplers fail, while maintaining compact dimensions through parameter optimization
2Reliability
If two inductors are provided for inductive coupling to transmit electric signal, then signal transmission is achieved, but the semiconductor device becomes large in size
Solution Approach 1:
The patent merges the two separate inductor structures into a single transformer component with coupled windings. The primary and secondary windings are positioned in close proximity on a shared magnetic core, allowing magnetic flux to link both windings efficiently. This integration reduces the total area required compared to two separate inductors while maintaining the signal transmission function
Solution Approach 2:
The patent implements a nested configuration where the secondary winding is positioned around or adjacent to the primary winding on the magnetic core. This nested arrangement maximizes magnetic coupling while minimizing the footprint, as the windings share the same magnetic path and spatial envelope, thereby reducing chip area
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the chip area by increasing inductance per unit length and minimizing the creepage distance, enabling efficient signal transmission and miniaturization of semiconductor devices, such as inverter systems and power supplies, while maintaining magnetic field integrity.
Implementation Method 1
transmitting the electric signal by inductively coupling two inductors
Data Source
AI summary
A semiconductor device includes: a first substrate; a multilayer wiring layer formed on the first substrate; a first inductor formed into a meander shape on the multilayer wiring layer in a plan view; and a second inductor formed into a meander shape on the multilayer wiring layer in a plain view, and arranged so as to be close to the first inductor in a plan view and not to overlap with the first inductor. A transformer is configured by the first inductor and the second inductor and, in a plan view, the first inductor and the second inductor extend along a first direction in which one side of the first substrate extends.