Meandering Pulsating Heat Pipe Cooling for Power Semiconductors
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Solution Overview
Problem
Existing cooling systems for power semiconductors in power electronics are inadequate in effectively managing high heat losses, leading to potential damage from overheating.
Innovation Solution
A cooling device with a baseplate, meandering cooling element, and a working medium in two phases (gas and liquid) that utilizes a pulsating heat pipe principle to efficiently transfer heat through channels and fins, enhancing heat dissipation without requiring a power supply.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a liquid cooling system or air cooling system is used for power semiconductors, then cooling capability is provided, but the system complexity increases and reliability decreases due to potential leakage and overheating risks
Solution Approach 1:
The patent utilizes phase transition of working medium (liquid to gas and back) within the cooling element to transfer heat. The working medium evaporates at the baseplate to absorb heat, then condenses in the condensation region to release heat, providing reliable passive cooling without complex external systems
Solution Approach 2:
The cooling element operates autonomously using natural convection and phase change of the working medium. The system self-regulates heat transfer without requiring external power supply or control systems, eliminating the need for pumps, fans, or complex control electronics that would reduce reliability
2Temperature
If a complex cooling system with multiple components is used, then cooling effectiveness improves, but the device complexity increases
Solution Approach 1:
The patent integrates the evaporator and condenser into a single sealed cooling element containing the working medium. The meandering channel design combines heat absorption and heat release functions within one compact component, eliminating the need for separate cooling circuits and reducing overall system complexity
Solution Approach 2:
The meandering (serpentine) channel configuration transforms a simple linear path into a three-dimensional space-efficient structure. This allows the working medium to traverse a longer path for enhanced heat exchange while maintaining a compact footprint, improving cooling effectiveness without increasing device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The cooling device achieves effective heat removal, preventing overheating and dissipating waste heat efficiently, even in high-power applications, with a passive cooling mechanism.
Implementation Method 1
the working medium is present simultaneously in the gaseous and the liquid state in the cooling element... gas bubbles and liquid columns are simultaneously present within the cooling element... Depending on a temperature of the cooling device, the volume ratio changes due to evaporation or condensation of the working medium
Implementation Method 2
the working medium is present simultaneously in the gaseous and the liquid state in the cooling element... volume ratio changes due to evaporation or condensation of the working medium
Implementation Method 3
a baseplate which can be connected in a heat-conducting manner to a component to be cooled... the baseplate is preferably formed from aluminum in order to permit good heat conduction
Implementation Method 4
At a surface of the cooling element, in particular of the central regions, the heat is released to the ambient air by convection
Data Source
AI summary
The invention relates to a cooling device (1) for cooling components (101), comprising a baseplate (2) which can be heat-conductively connected to a component (101) to be cooled, a deflection region (3), an intermediate region (4) between the baseplate (2) and the deflection region (3), and a cooling element (5), which is formed in a meandering shape and has multiple central segments (51) and multiple deflection segments (52), wherein the central segments (51) each extend from the baseplate (2) to the deflection region (3), wherein the deflection segments (52) each create a change of direction within the baseplate (2) and within the deflection region (3) and connect two respective central segments (51) to one another, wherein the cooling element (5) is filled with a working material, which is simultaneously gaseous and liquid in the cooling element (5), and wherein the central segments (51) have a plurality of channels (53).