Meandering Interconnect Layout for Flexible Low-Capacitance Routing
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Solution Overview
Problem
Conductive paths in electronic devices face challenges in balancing low resistance, low capacitance, and flexibility, particularly when requiring contortion, as increasing thickness or width can compromise these properties.
Innovation Solution
A meandering interconnect system comprising a multiplicity of meandering conductive lines supported by a deformable substrate, allowing for resilient contortion while maintaining electrical connections to conductive lines, which can be used in touch panels and other applications to manage signal routing effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the thickness of a conductive path is increased to improve conductivity, then resistance decreases, but rigidity increases and flexibility decreases
Solution Approach 1:
The conductive path is divided into multiple parallel conductive lines within the interconnect structure. This segmentation allows the overall structure to maintain low resistance through multiple parallel pathways while remaining thin and flexible, as each individual line can be made thin but their collective effect provides the desired conductivity without compromising flexibility
Solution Approach 2:
The patent transitions from a single thick conductive path to multiple thin parallel conductive lines, effectively using dimensional arrangement (spatial distribution) to achieve the desired electrical properties while maintaining mechanical flexibility. The conductive lines are arranged in a meandering pattern across multiple dimensions to optimize both electrical and mechanical performance
2Reliability
If the width of a conductive path is increased to improve conductivity, then resistance decreases, but capacitance increases
Solution Approach 1:
The conductive path is segmented into multiple thin parallel lines rather than one wide path. This provides multiple parallel conduction pathways that collectively achieve low resistance while each individual thin line maintains low capacitance, thus resolving the contradiction between conductivity and capacitance
Solution Approach 2:
Instead of increasing width in a single dimension, the patent distributes conductive material across multiple parallel lines in spatial arrangement, achieving equivalent or superior conductivity through dimensional optimization while minimizing capacitance by keeping each line thin
3Strength
If a rigid conductive path is used to maintain structural integrity, then strength increases, but ability to contort decreases
Solution Approach 1:
The rigid conductive path is segmented into multiple thin flexible lines that can bend and contort independently. The meandering interconnect structure with multiple parallel lines allows the assembly to maintain structural integrity through distributed load bearing while achieving flexibility and contortion capability that a single rigid path cannot provide
Solution Approach 2:
The patent employs thin film conductive lines arranged in a meandering pattern, which inherently provide flexibility and contortion capability. The thin film structure allows the conductive paths to bend and deform with the substrate while maintaining electrical connectivity, resolving the contradiction between structural integrity and contortion capability
Data Source
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Figure 7A~9C
AI summary
An apparatus comprising a first plurality of first conductive lines; and a first meandering interconnect supported in a spaced relationship from a deformable substrate, wherein the first meandering interconnect comprises a first multiplicity of meandering conductive lines each of which is electrically connected to one of the first plurality of first conductive lines.