Measuring Device Anisotropic Thermal Conductivity Unit
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Solution Overview
Problem
Existing field devices, such as thermometers, face challenges in achieving high mechanical stability and even heat distribution due to thermal expansion coefficients of different materials and the quality of soldering connections, which can affect thermal properties and mechanical integrity.
Innovation Solution
Incorporating a unit with anisotropic thermal conductivity, such as graphite, to strengthen the connection between the sensor element and other components, ensuring thermal balance and mechanical stability through a design that allows for even heat distribution and reduced thermal tension.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a solder connection is used to connect the sensor element to the sensor head, then mechanical stability is improved, but thermal properties are adversely affected due to thermal expansion differences and variable solder quality
Solution Approach 1:
The patent removes the solder connection from the system entirely. Instead of using solder to connect the sensor element to the sensor head, the sensor element is directly attached to the bottom surface of the sensor head through mechanical means (adhesive, potting compound, or direct bonding), eliminating the thermal expansion mismatch and quality variability inherent in solder joints.
Solution Approach 2:
The patent introduces an intermediary material (adhesive or potting compound) between the sensor element and sensor head that accommodates thermal expansion differences while maintaining both mechanical strength and thermal conductivity. This intermediary layer resolves the contradiction by providing a compliant interface that neither rigidly transmits thermal stress nor creates significant thermal resistance.
2Strength
If different materials with different thermal expansion coefficients are used in the sensor assembly, then mechanical stability is improved through material strength, but thermal tension and stress increase during temperature changes
Solution Approach 1:
The patent changes the thermal and mechanical parameters of the connection system by eliminating rigid solder joints and introducing compliant bonding methods. The adhesive or potting compound has tailored thermal expansion properties that match or accommodate the sensor element and sensor head materials, reducing thermal stress while maintaining mechanical integrity across temperature variations.
3Strength
If solder quality and wetting are optimized to improve mechanical stability, then manufacturing complexity and quality control requirements increase
Solution Approach 1:
The patent eliminates the soldering process entirely from the manufacturing sequence. By using adhesive bonding or direct attachment methods, the complex requirements of solder wetting, flux application, reflow temperature control, and inspection are removed, significantly simplifying the manufacturing process while maintaining or improving connection reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances mechanical stability and reduces thermal transition resistance while maintaining optimal thermal properties, minimizing adverse mechanical tensions and ensuring reliable connections.
Implementation Method 1
a unit with anisotropic thermal conductivity, such as graphite, to strengthen the connection between the sensor element and other components, ensuring thermal balance and mechanical stability through a design that allows for even heat distribution
Implementation Method 2
Inventive provision 1 states that the device comprises at least one sensor element and a unit comprising at least partially a material with anisotropic thermal conductivity
Data Source
Figure 1
Figure 2a~4
AI summary
The present invention relates to a device (1) for determining and/or monitoring at least one process variable of a medium (M) comprising at least one sensor element (5) and a unit (8) at least partially comprising a material with anisotropic thermal conductivity. According to the invention the unit (8) is frictionally connected to the sensor element (5), and in particular the unit (8) is frictionally fastened on a surface of the sensor element (5).